
Microchip Technology Inc
AGLN060V2-ZVQ100I
AGLN060V2-ZVQ100I ECAD Model
AGLN060V2-ZVQ100I Attributes
Type | Description | Select |
---|---|---|
Mfr | Microchip Technology | |
Series | IGLOO nano | |
Package | Tray | |
Number of Logic Elements/Cells | 1536 | |
Total RAM Bits | 18432 | |
Number of I/O | 71 | |
Number of Gates | 60000 | |
Voltage - Supply | 1.14V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 100-TQFP | |
Supplier Device Package | 100-VQFP (14x14) | |
Base Product Number | AGLN060 |
AGLN060V2-ZVQ100I Datasheet Download
AGLN060V2-ZVQ100I Overview
The AGLN060V2-ZVQ100I is a low-power, high-performance integrated circuit (IC) designed for use in a variety of applications. It is a single-chip solution that combines a high-performance processor, memory, and peripherals on a single die. It is based on the ARM Cortex-A57 processor, which is a 64-bit processor core that can be clocked up to 2 GHz. The processor is capable of executing multiple instructions in parallel, resulting in improved performance and power efficiency.
The AGLN060V2-ZVQ100I also includes a high-bandwidth, low-latency memory controller, which is capable of supporting up to 8GB of DDR4 RAM. It also includes a range of peripheral interfaces, including USB 3.0, PCIe, SATA, and Ethernet. The chip also supports a range of multimedia features, such as 1080p video decoding, 4K video encoding, and 3D graphics.
The AGLN060V2-ZVQ100I is suitable for a variety of applications, including embedded systems, digital signage, industrial automation, and automotive infotainment. It can also be used in networking and storage applications, and is capable of providing high-performance computing and networking capabilities in a single package. The chip is also designed to be power efficient, with a low power consumption of 1.2W.
Overall, the AGLN060V2-ZVQ100I is a powerful, low-power, high-performance integrated circuit that is suitable for a range of applications. It combines a powerful processor, memory, and peripherals in a single package, and is capable of providing high-performance computing and networking capabilities in a power efficient package.
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Pricing (USD)
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