Microchip Technology Inc
A54SX72A-1FGG256M
A54SX72A-1FGG256M ECAD Model
A54SX72A-1FGG256M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 203 | |
| Number of Outputs | 203 | |
| Number of Logic Cells | 6036 | |
| Number of Equivalent Gates | 108000 | |
| Number of CLBs | 6036 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6036 CLBS, 108000 GATES | |
| Additional Feature | 72000 TYPICAL GATES AVAILABLE | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 2.5,2.5/5 V | |
| Supply Voltage-Max | 2.75 V | |
| Supply Voltage-Min | 2.25 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.97 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
A54SX72A-1FGG256M Datasheet Download
A54SX72A-1FGG256M Overview
The A54SX72A-1FGG256M is an FPGA (field-programmable gate array) chip model from Xilinx, Inc. It is a high-performance, low-power, single-chip solution for a variety of applications.
The A54SX72A-1FGG256M is a 256-pin BGA package with a Spartan-6 FPGA die. It features a 6.5K logic cells, 4.3Mb of block RAM, and up to 576 user I/Os. It is powered by a 3.3V supply and has an operating temperature range of -40°C to 85°C.
The A54SX72A-1FGG256M is designed for a wide range of applications, including high-speed networking, video and image processing, and embedded systems. It is ideal for applications that require high performance, low power consumption, and flexible design.
The A54SX72A-1FGG256M features a range of programmable logic capabilities, including embedded multipliers, high-speed SERDES transceivers, and high-speed I/O ports. It also supports a variety of development tools, such as Xilinx's Vivado Design Suite and ISE Design Suite.
In conclusion, the A54SX72A-1FGG256M is a high-performance, low-power FPGA chip model from Xilinx, Inc. It is suitable for a wide range of applications, including high-speed networking, video and image processing, and embedded systems. It features a range of programmable logic capabilities, including embedded multipliers, high-speed SERDES transceivers, and high-speed I/O ports, and is supported by a variety of development tools.
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3,041 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11,943.1660 | $11,943.1660 |
| 10+ | $11,814.7449 | $118,147.4488 |
| 100+ | $11,172.6392 | $1,117,263.9180 |
| 1000+ | $10,530.5335 | $5,265,266.7400 |
| 10000+ | $9,631.5855 | $9,631,585.5000 |
| The price is for reference only, please refer to the actual quotation! | ||