Microchip Technology Inc
A54SX32A-1BG329M
A54SX32A-1BG329M ECAD Model
A54SX32A-1BG329M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 249 | |
| Number of Outputs | 249 | |
| Number of Logic Cells | 2880 | |
| Number of Equivalent Gates | 48000 | |
| Number of CLBs | 2880 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2880 CLBS, 48000 GATES | |
| Additional Feature | 32000 TYPICAL GATES AVAILABLE | |
| Clock Frequency-Max | 278 MHz | |
| Power Supplies | 2.5,3.3/5 V | |
| Supply Voltage-Max | 2.75 V | |
| Supply Voltage-Min | 2.25 V | |
| JESD-30 Code | S-PBGA-B329 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 329 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA329,23X23,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA329,23X23,50 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
A54SX32A-1BG329M Datasheet Download
A54SX32A-1BG329M Overview
The A54SX32A-1BG329M is a low-power, high-performance Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a member of the Spartan-6 family and is designed to provide a cost-effective solution for a wide range of applications.
The chip features 32,768 logic cells, 1,536 Kbits of block RAM, and up to 576 18-Kbit distributed RAM blocks. It also supports up to 4,608 user-defined I/O pins and has a maximum clock frequency of 320 MHz. Additionally, the A54SX32A-1BG329M supports up to eight dedicated high-speed serial transceivers and up to 24 dedicated high-speed differential I/O pairs.
The chip is ideal for applications that require low power consumption, high performance, and flexibility. It is suitable for use in consumer electronics, automotive, industrial, and medical applications. It can be used to create custom digital logic designs, embedded systems, and system-on-chip (SoC) designs.
The A54SX32A-1BG329M is available in a variety of packages, including a 6x6mm ball grid array (BGA) package. It is RoHS compliant and is rated for operation over a temperature range of -40°C to +85°C.
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3,881 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,696.1751 | $1,696.1751 |
| 10+ | $1,677.9367 | $16,779.3666 |
| 100+ | $1,586.7445 | $158,674.4454 |
| 1000+ | $1,495.5522 | $747,776.1220 |
| 10000+ | $1,367.8832 | $1,367,883.1500 |
| The price is for reference only, please refer to the actual quotation! | ||