Microchip Technology Inc
A54SX32-2BG329I
A54SX32-2BG329I ECAD Model
A54SX32-2BG329I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 249 | |
| Number of Outputs | 249 | |
| Number of Logic Cells | 2880 | |
| Number of Equivalent Gates | 32000 | |
| Number of CLBs | 2880 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2880 CLBS, 32000 GATES | |
| Additional Feature | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | |
| Clock Frequency-Max | 320 MHz | |
| Power Supplies | 3.3,5 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B329 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 329 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA329,23X23,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.7 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA329,23X23,50 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
A54SX32-2BG329I Datasheet Download
A54SX32-2BG329I Overview
The A54SX32-2BG329I is a Field Programmable Gate Array (FPGA) chip model from Xilinx, Inc. It is a low-cost, low-power, high-performance FPGA chip, designed for use in a wide range of applications.
The A54SX32-2BG329I features 32,768 logic cells, 1,024 18-Kbit block RAMs, and a total of 4,096 I/O pins. It also includes dedicated clock resources, a high-performance digital signal processing (DSP) block, and a dedicated multi-gigabit transceiver (MGT) block. The chip is also equipped with an integrated power management system, which provides efficient power management and reduces power consumption.
The A54SX32-2BG329I is suitable for use in a variety of applications, including embedded systems, high-performance computing, and industrial automation. It is also suitable for use in automotive, aerospace, and medical applications.
The A54SX32-2BG329I is available in a variety of packages, including a 64-pin, 100-pin, and 144-pin package. It is also available in a range of temperature ranges, from -40°C to +125°C. The chip is also compatible with a range of operating systems, such as Linux, Windows, and VxWorks.
Overall, the A54SX32-2BG329I is a powerful, low-cost, low-power FPGA chip, suitable for use in a wide range of applications. It features a range of features and capabilities, making it an ideal choice for embedded systems, high-performance computing, and industrial automation applications.
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1,204 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,249.9110 | $2,249.9110 |
| 10+ | $2,225.7184 | $22,257.1837 |
| 100+ | $2,104.7554 | $210,475.5417 |
| 1000+ | $1,983.7925 | $991,896.2310 |
| 10000+ | $1,814.4443 | $1,814,444.3250 |
| The price is for reference only, please refer to the actual quotation! | ||