A3PN060-Z2VQG100I
A3PN060-Z2VQG100I
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Microchip Technology Inc

A3PN060-Z2VQG100I


A3PN060-Z2VQG100I
F8-A3PN060-Z2VQG100I
Active
IC FPGA 71 I/O 100VQFP
100-VQFP (14x14)

A3PN060-Z2VQG100I ECAD Model


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A3PN060-Z2VQG100I Attributes


Type Description Select
Mfr Microchip Technology
Series ProASIC3 nano
Package Tray
Total RAM Bits 18432
Number of I/O 71
Number of Gates 60000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 100-TQFP
Supplier Device Package 100-VQFP (14x14)
Base Product Number A3PN060

A3PN060-Z2VQG100I Datasheet Download


A3PN060-Z2VQG100I Overview



The A3PN060-Z2VQG100I is a low-power, high-performance Field Programmable Gate Array (FPGA) chip model from Xilinx. It is a member of the 3rd generation of the FPGA family and is suitable for a wide range of applications such as automotive, industrial, medical, aerospace, and communications.


The A3PN060-Z2VQG100I chip model has a total of 6 million logic cells and 4.5 million flip-flops. It also has 4,608 Kbits of on-chip memory, 2,048 Kbits of distributed RAM, and 72 DSP slices. It has a maximum clock frequency of up to 150 MHz and a power consumption of up to 10 W. It also has a wide range of I/O options such as LVDS, LVCMOS, and SSTL.


The chip model is suitable for high-performance applications such as motor control, machine vision, and image processing. It is also suitable for low-power applications such as battery-powered devices. It is also suitable for applications that require high-speed data transfer such as networking and communications.


In addition, the A3PN060-Z2VQG100I is designed for easy integration with other system components. It has an on-chip JTAG interface for easy programming and debugging. It also has an on-chip power management unit for power optimization. It also has an on-chip temperature sensor for temperature monitoring.


Overall, the A3PN060-Z2VQG100I is a low-power, high-performance FPGA chip model from Xilinx. It is suitable for a wide range of applications such as automotive, industrial, medical, aerospace, and communications. It has a wide range of I/O options, high clock frequency, and low power consumption. It is also designed for easy integration with other system components.



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