Microchip Technology Inc
A3PE3000L-FGG896I
A3PE3000L-FGG896I ECAD Model
A3PE3000L-FGG896I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 620 | |
| Number of Outputs | 620 | |
| Number of Logic Cells | 75264 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 75264 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 75264 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 1.2/1.5,1.2/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.44 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA896,30X30,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
A3PE3000L-FGG896I Datasheet Download
A3PE3000L-FGG896I Overview
The A3PE3000L-FGG896I is a low-power Field Programmable Gate Array (FPGA) chip from Altera Corporation. It is designed for use in a variety of applications, including embedded systems, communications, industrial automation, and automotive. This FPGA chip features a high-performance architecture, with a total of 3,000 logic elements, as well as 896 embedded memory blocks. It is also equipped with a high-speed transceiver, with a maximum data rate of up to 12.5 Gbps. Additionally, the chip has a wide range of I/O options, including LVDS, LVCMOS, and SSTL.
The A3PE3000L-FGG896I is a low-power device, with a maximum power consumption of only 5.8 W. It is also designed for use in harsh environments, with an operating temperature range of -40 to +85 degrees Celsius. In addition, it features a range of advanced features, including partial reconfiguration, clock management, and a wide range of security options.
Overall, the A3PE3000L-FGG896I is a powerful and versatile FPGA chip, designed for use in a variety of applications. It offers a high-performance architecture, with a wide range of I/O options, as well as advanced features such as partial reconfiguration and security options. It is also designed for low-power operation, with a maximum power consumption of only 5.8 W.
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3,953 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $414.9660 | $414.9660 |
| 10+ | $410.5040 | $4,105.0400 |
| 100+ | $388.1940 | $38,819.4000 |
| 1000+ | $365.8840 | $182,942.0000 |
| 10000+ | $334.6500 | $334,650.0000 |
| The price is for reference only, please refer to the actual quotation! | ||