
Microchip Technology Inc
A3P600L-1FGG144
A3P600L-1FGG144 ECAD Model
A3P600L-1FGG144 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 97 | |
Number of Outputs | 97 | |
Number of Logic Cells | 13824 | |
Number of Equivalent Gates | 600000 | |
Number of CLBs | 13824 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 13824 CLBS, 600000 GATES | |
Clock Frequency-Max | 350 MHz | |
Power Supplies | 1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA144,12X12,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm | |
Length | 13 mm | |
Seated Height-Max | 1.55 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | LBGA, BGA144,12X12,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
A3P600L-1FGG144 Datasheet Download
A3P600L-1FGG144 Overview
The A3P600L-1FGG144 is a Field Programmable Gate Array (FPGA) chip manufactured by Actel Corporation. It is a low-power device designed for advanced applications in industrial, automotive, medical, and military applications. The chip is based on the company’s Fusion architecture, which is a combination of both the ProASIC3 and IGLOO architectures.
The A3P600L-1FGG144 has a total of 144,000 system gates, 1,500 Kbits of embedded memory, and 1,500 Kbits of distributed memory. It includes a total of six dedicated I/O blocks, each capable of supporting up to 64 I/O pins. The chip also features a wide range of dedicated peripherals such as a 10/100 Ethernet MAC, a CAN controller, a USB 2.0 OTG controller, and a UART.
The A3P600L-1FGG144 is designed to operate at a maximum frequency of 200 MHz and is capable of delivering up to 200 million system gates per second. It is also designed to operate at a wide range of temperatures, from -40°C to +125°C. It is available in a 5x5 mm, 144-pin, 0.8 mm-pitch BGA package.
The A3P600L-1FGG144 is suitable for applications such as embedded systems, motor control, industrial automation, automotive control, medical devices, communication systems, and military systems. It is also suitable for applications requiring low-power, high-performance, and high-reliability solutions.
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4,262 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $25.8242 | $25.8242 |
10+ | $25.5466 | $255.4656 |
100+ | $24.1582 | $2,415.8160 |
1000+ | $22.7698 | $11,384.8800 |
10000+ | $20.8260 | $20,826.0000 |
The price is for reference only, please refer to the actual quotation! |