Microchip Technology Inc
A3P400-2FGG256I
A3P400-2FGG256I ECAD Model
A3P400-2FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 400000 | |
| Number of CLBs | 9216 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9216 CLBS, 400000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.8 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
A3P400-2FGG256I Datasheet Download
A3P400-2FGG256I Overview
The A3P400-2FGG256I is a Field Programmable Gate Array (FPGA) chip manufactured by Actel Corporation. It is a low-cost, low-power FPGA device with a wide range of features and capabilities. It is available in a 256-pin Fine-Pitch Ball Grid Array (BGA) package and is suitable for a wide range of applications.
The A3P400-2FGG256I features a high-density logic array with up to 4 million system gates, up to 4,096 Kbits of embedded memory, up to 1,024 Kbits of distributed RAM, up to 1,024 Kbits of distributed ROM, and up to 128 Kbits of distributed FIFO. It also offers a wide range of I/O options, such as LVDS, LVCMOS, PCI Express and USB, as well as a wide range of communication protocols, such as Ethernet, I2C, SPI, and UART.
The A3P400-2FGG256I is suitable for a wide range of applications, including industrial automation, medical, automotive, consumer electronics, communications and networking, and aerospace. It is also suitable for a wide range of applications requiring high performance, low power, and low cost.
Overall, the A3P400-2FGG256I is a low-cost, low-power FPGA device with a wide range of features and capabilities. It is suitable for a wide range of applications, including industrial automation, medical, automotive, consumer electronics, communications and networking, and aerospace.
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3,771 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $73.7643 | $73.7643 |
| 10+ | $72.9712 | $729.7118 |
| 100+ | $69.0054 | $6,900.5355 |
| 1000+ | $65.0395 | $32,519.7650 |
| 10000+ | $59.4874 | $59,487.3750 |
| The price is for reference only, please refer to the actual quotation! | ||