Microchip Technology Inc
A3P250-1VQ100M
A3P250-1VQ100M ECAD Model
A3P250-1VQ100M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 6144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 250000 GATES | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | TFQFP, | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
A3P250-1VQ100M Datasheet Download
A3P250-1VQ100M Overview
The A3P250-1VQ100M is an FPGA (Field Programmable Gate Array) chip from the A3P series of products by Actel Corporation. It is a low-power, high-performance device designed for use in a wide variety of applications, including consumer electronics, industrial automation, medical equipment, and automotive systems.
The chip features a 1.2V core voltage, with a maximum operating temperature of 85°C. It has a total of 250K system gates, with a maximum IO count of 100. It supports up to 32 MB of external memory, and features an 8-bit ADC/DAC with a 6-bit resolution. The chip also supports up to 32 user-defined I/Os.
The A3P250-1VQ100M is based on the Actel Fusion architecture, which combines the benefits of FPGA and ASIC technologies. It features a low-power, high-performance design, with a low-cost and low-risk implementation. The chip is also designed for ease of use and scalability, with a user-friendly development environment.
The A3P250-1VQ100M is ideal for use in applications such as consumer electronics, industrial automation, medical equipment, automotive systems, and more. It is also suitable for use in a variety of embedded systems, such as embedded controllers, embedded communication systems, and embedded storage systems. The chip is also suitable for use in a variety of applications, such as image processing, video processing, and signal processing.
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3,589 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $166.6716 | $166.6716 |
| 10+ | $164.8795 | $1,648.7946 |
| 100+ | $155.9186 | $15,591.8616 |
| 1000+ | $146.9578 | $73,478.8880 |
| 10000+ | $134.4126 | $134,412.6000 |
| The price is for reference only, please refer to the actual quotation! | ||