Microchip Technology Inc
A3P1000L-FGG256I
A3P1000L-FGG256I ECAD Model
A3P1000L-FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 177 | |
| Number of Outputs | 177 | |
| Number of Logic Cells | 24576 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 24576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24576 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Power Supplies | 1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.8 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
A3P1000L-FGG256I Datasheet Download
A3P1000L-FGG256I Overview
The A3P1000L-FGG256I is an FPGA chip model from the Altera Corporation. It is an entry-level device in the A3P family of FPGAs, which are optimized for low power, low cost, and high performance. The A3P1000L-FGG256I has 256 I/O pins, and is capable of up to 1 million logic elements. It is a low-cost, low-power device, and is suitable for a wide range of applications.
The A3P1000L-FGG256I has a wide range of features, including a dual-channel LVDS transceiver, embedded memory, and a high-speed transceiver. It also has an on-chip oscillator and a low-voltage differential signaling (LVDS) interface. The device also features power-saving features such as dynamic power management and clock gating.
The A3P1000L-FGG256I is suitable for a wide range of applications, including industrial automation, medical imaging, and wireless communications. The device is also suitable for use in automotive, aerospace, and defense applications. It is also suitable for use in consumer electronics, such as home entertainment systems, digital cameras, and portable media players.
The A3P1000L-FGG256I is a low-cost, low-power FPGA chip model that is suitable for a wide range of applications. It is capable of up to 1 million logic elements, and features a wide range of features such as a dual-channel LVDS transceiver, embedded memory, and a high-speed transceiver. It is suitable for use in industrial automation, medical imaging, wireless communications, automotive, aerospace, and defense applications.
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2,829 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $71.9150 | $71.9150 |
| 10+ | $71.1418 | $711.4176 |
| 100+ | $67.2754 | $6,727.5360 |
| 1000+ | $63.4090 | $31,704.4800 |
| 10000+ | $57.9960 | $57,996.0000 |
| The price is for reference only, please refer to the actual quotation! | ||