A3P1000-FGG256T
A3P1000-FGG256T
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rohs

Microchip Technology Inc

A3P1000-FGG256T


A3P1000-FGG256T
F8-A3P1000-FGG256T
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

A3P1000-FGG256T ECAD Model


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A3P1000-FGG256T Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Inputs 177
Number of Outputs 177
Number of Logic Cells 24576
Number of Equivalent Gates 1000000
Number of CLBs 24576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Temperature Grade AUTOMOTIVE
Package Shape SQUARE
Technology CMOS
Organization 24576 CLBS, 1000000 GATES
Clock Frequency-Max 350 MHz
Power Supplies 1.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.8 mm
Ihs Manufacturer MICROSEMI CORP
Package Description BGA, BGA256,16X16,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

A3P1000-FGG256T Datasheet Download


A3P1000-FGG256T Overview



The A3P1000-FGG256T chip is a field-programmable gate array (FPGA) manufactured by Lattice Semiconductor. It is based on the company’s low-power, low-cost, and low-footprint A3P family of FPGAs. It is designed to provide a cost-effective solution for a wide range of applications, including embedded systems, industrial automation, medical, aerospace, and automotive.


The A3P1000-FGG256T chip features 256 logic cells, 4Kbits of embedded block RAM, and up to 32Kbits of embedded distributed RAM. It also includes up to 19 DSP blocks, 16 I/O banks, and up to 1.2 million system gates. It is available in a 256-ball VFBGA package and supports a wide operating temperature range of -40°C to +85°C.


The A3P1000-FGG256T chip offers a range of features to help designers reduce system costs, including integrated phase-locked loops (PLLs), differential clock support, clock domain crossing (CDC) support, and advanced power management. It is also designed to support a range of development tools, including Lattice Diamond, Lattice Radiant, and Lattice ispLEVER.


The A3P1000-FGG256T chip is an ideal solution for applications that require low power, low cost, and high performance. It can be used in a variety of embedded applications, such as industrial automation, medical, aerospace, automotive, and consumer electronics. It is also suitable for applications that require high levels of integration, such as image processing, video processing, and communications.



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Unit Price: $261.1202
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Pricing (USD)

QTY Unit Price Ext Price
1+ $242.8418 $242.8418
10+ $240.2306 $2,402.3058
100+ $227.1746 $22,717.4574
1000+ $214.1186 $107,059.2820
10000+ $195.8402 $195,840.1500
The price is for reference only, please refer to the actual quotation!

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