
Microchip Technology Inc
A3P1000-FGG256T
A3P1000-FGG256T ECAD Model
A3P1000-FGG256T Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 177 | |
Number of Outputs | 177 | |
Number of Logic Cells | 24576 | |
Number of Equivalent Gates | 1000000 | |
Number of CLBs | 24576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | AEC-Q100 | |
Temperature Grade | AUTOMOTIVE | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 24576 CLBS, 1000000 GATES | |
Clock Frequency-Max | 350 MHz | |
Power Supplies | 1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.8 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
A3P1000-FGG256T Datasheet Download
A3P1000-FGG256T Overview
The A3P1000-FGG256T chip is a field-programmable gate array (FPGA) manufactured by Lattice Semiconductor. It is based on the company’s low-power, low-cost, and low-footprint A3P family of FPGAs. It is designed to provide a cost-effective solution for a wide range of applications, including embedded systems, industrial automation, medical, aerospace, and automotive.
The A3P1000-FGG256T chip features 256 logic cells, 4Kbits of embedded block RAM, and up to 32Kbits of embedded distributed RAM. It also includes up to 19 DSP blocks, 16 I/O banks, and up to 1.2 million system gates. It is available in a 256-ball VFBGA package and supports a wide operating temperature range of -40°C to +85°C.
The A3P1000-FGG256T chip offers a range of features to help designers reduce system costs, including integrated phase-locked loops (PLLs), differential clock support, clock domain crossing (CDC) support, and advanced power management. It is also designed to support a range of development tools, including Lattice Diamond, Lattice Radiant, and Lattice ispLEVER.
The A3P1000-FGG256T chip is an ideal solution for applications that require low power, low cost, and high performance. It can be used in a variety of embedded applications, such as industrial automation, medical, aerospace, automotive, and consumer electronics. It is also suitable for applications that require high levels of integration, such as image processing, video processing, and communications.
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3,579 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $242.8418 | $242.8418 |
10+ | $240.2306 | $2,402.3058 |
100+ | $227.1746 | $22,717.4574 |
1000+ | $214.1186 | $107,059.2820 |
10000+ | $195.8402 | $195,840.1500 |
The price is for reference only, please refer to the actual quotation! |