
Microchip Technology Inc
A3P1000-1FGG256
A3P1000-1FGG256 ECAD Model
A3P1000-1FGG256 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 1.5 V | |
Number of Equivalent Gates | 1000000 | |
Number of CLBs | 24576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 24576 CLBS, 1000000 GATES | |
Clock Frequency-Max | 350 MHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.8 mm | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
A3P1000-1FGG256 Datasheet Download
A3P1000-1FGG256 Overview
The A3P1000-1FGG256 is a Field Programmable Gate Array (FPGA) chip from Actel Corporation. It is a low-power, high-performance FPGA device with a wide range of applications. The chip is based on the A3P architecture and has a total of 256 I/O pins. It has a total of 1 million system gates and up to 8,192 logic elements. It also has a high-speed SERDES (Serializer/Deserializer) for high-speed data transmission.
The chip is designed for a wide range of applications including industrial, automotive, consumer, and communications. It is suitable for high-speed designs, including those with high-speed SERDES, and for designs requiring low power consumption. The chip also supports multiple clock domains and advanced design techniques such as clock gating and power gating.
The chip is available in a variety of packages, including a 256-pin BGA, a 176-pin BGA, and a 144-pin TQFP. It has an operating temperature range of -40 to +85°C and is compliant with JEDEC standards. It is also RoHS compliant, making it suitable for use in environmentally sensitive applications.
The A3P1000-1FGG256 is a powerful, low-power FPGA device that is ideal for a wide range of applications. It is suitable for high-speed designs, including those with high-speed SERDES, and for designs requiring low power consumption. It is available in a variety of packages and is compliant with JEDEC standards.
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3,767 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $107.5089 | $107.5089 |
10+ | $106.3529 | $1,063.5292 |
100+ | $100.5729 | $10,057.2870 |
1000+ | $94.7928 | $47,396.4100 |
10000+ | $86.7008 | $86,700.7500 |
The price is for reference only, please refer to the actual quotation! |