A3P1000-1FGG256
A3P1000-1FGG256
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rohs

Microchip Technology Inc

A3P1000-1FGG256


A3P1000-1FGG256
F8-A3P1000-1FGG256
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

A3P1000-1FGG256 ECAD Model


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A3P1000-1FGG256 Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Number of Equivalent Gates 1000000
Number of CLBs 24576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 24576 CLBS, 1000000 GATES
Clock Frequency-Max 350 MHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.8 mm
Ihs Manufacturer MICROSEMI CORP
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01

A3P1000-1FGG256 Datasheet Download


A3P1000-1FGG256 Overview



The A3P1000-1FGG256 is a Field Programmable Gate Array (FPGA) chip from Actel Corporation. It is a low-power, high-performance FPGA device with a wide range of applications. The chip is based on the A3P architecture and has a total of 256 I/O pins. It has a total of 1 million system gates and up to 8,192 logic elements. It also has a high-speed SERDES (Serializer/Deserializer) for high-speed data transmission.


The chip is designed for a wide range of applications including industrial, automotive, consumer, and communications. It is suitable for high-speed designs, including those with high-speed SERDES, and for designs requiring low power consumption. The chip also supports multiple clock domains and advanced design techniques such as clock gating and power gating.


The chip is available in a variety of packages, including a 256-pin BGA, a 176-pin BGA, and a 144-pin TQFP. It has an operating temperature range of -40 to +85°C and is compliant with JEDEC standards. It is also RoHS compliant, making it suitable for use in environmentally sensitive applications.


The A3P1000-1FGG256 is a powerful, low-power FPGA device that is ideal for a wide range of applications. It is suitable for high-speed designs, including those with high-speed SERDES, and for designs requiring low power consumption. It is available in a variety of packages and is compliant with JEDEC standards.



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Unit Price: $115.601
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Pricing (USD)

QTY Unit Price Ext Price
1+ $107.5089 $107.5089
10+ $106.3529 $1,063.5292
100+ $100.5729 $10,057.2870
1000+ $94.7928 $47,396.4100
10000+ $86.7008 $86,700.7500
The price is for reference only, please refer to the actual quotation!

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