Microchip Technology Inc
A3P1000-1FGG144M
A3P1000-1FGG144M ECAD Model
A3P1000-1FGG144M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 97 | |
| Number of Outputs | 97 | |
| Number of Logic Cells | 24576 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 24576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 24576 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 350 MHz | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA144,12X12,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| Length | 13 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, BGA144,12X12,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
A3P1000-1FGG144M Datasheet Download
A3P1000-1FGG144M Overview
The A3P1000-1FGG144M is a low-power, high-performance FPGA chip model from the A3P family of products by Lattice Semiconductor. It is a small-form-factor, low-cost device that is ideal for use in a wide range of embedded applications.
The A3P1000-1FGG144M has a total of 144 general-purpose I/O pins, which are divided into two banks of 72 pins each. It also has a total of 7,000 logic elements, including 4,000 Flip-Flops, and 1,000 Look-Up Tables (LUTs). The device also features a 100MHz maximum clock frequency, and a total of 8Kb of on-chip RAM.
The A3P1000-1FGG144M is suitable for a variety of embedded applications, such as industrial control, automotive, consumer electronics, medical, and aerospace. It is especially well-suited for applications that require low-power and high-performance, such as motor control, digital signal processing, and image processing.
The A3P1000-1FGG144M is designed for use in a wide range of operating temperatures, from -40°C to 85°C, and is available in a variety of packages, including BGA, PQFP, and VQFP. It also supports multiple programming options, including JTAG, Slave Serial, and Master Serial.
Overall, the A3P1000-1FGG144M is a low-power, high-performance FPGA chip model that is ideal for a variety of embedded applications. It has a total of 144 I/O pins, 7,000 logic elements, and 8Kb of on-chip RAM, and is available in a variety of packages. It is well-suited for applications that require low-power and high-performance.
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3,920 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $729.5154 | $729.5154 |
| 10+ | $721.6712 | $7,216.7118 |
| 100+ | $682.4499 | $68,244.9924 |
| 1000+ | $643.2287 | $321,614.3320 |
| 10000+ | $588.3189 | $588,318.9000 |
| The price is for reference only, please refer to the actual quotation! | ||