OR3T306S208I-DB
OR3T306S208I-DB
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Lattice Semiconductor Corporation

OR3T306S208I-DB


OR3T306S208I-DB
F11-OR3T306S208I-DB
Active
IC FPGA 171 I/O 208QFP
208-PQFP (28x28)

OR3T306S208I-DB ECAD Model


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OR3T306S208I-DB Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ORCA® 3
Package Tray
Number of Logic Elements/Cells 1568
Total RAM Bits 25600
Number of I/O 171
Number of Gates 48000
Voltage - Supply 3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28x28)
Base Product Number OR3T30

OR3T306S208I-DB Datasheet Download


OR3T306S208I-DB Overview



The OR3T306S208I-DB chip model is a multi-function programmable logic device (PLD) developed by ORCA. It is a low-cost, high-performance, field-programmable gate array (FPGA) device with a capacity of up to 3 million gates. This chip model is designed to provide a high degree of flexibility and scalability, making it suitable for a wide range of applications.


The OR3T306S208I-DB chip model has a wide range of features, including an embedded processor core, embedded SRAM, embedded flash memory, and a wide range of I/O options. It also features an on-chip power management unit, which allows for efficient power management. The chip model also supports a wide range of programming languages, including Verilog, VHDL, and C/C++.


The OR3T306S208I-DB chip model is suitable for a variety of applications, including embedded systems, industrial automation, medical electronics, automotive electronics, and communications systems. It is also suitable for use in a wide range of high-speed applications, such as high-speed digital signal processing (DSP) and high-speed networking.


In summary, the OR3T306S208I-DB chip model is a low-cost, high-performance, field-programmable gate array (FPGA) device with a capacity of up to 3 million gates. It has a wide range of features, including an embedded processor core, embedded SRAM, embedded flash memory, and a wide range of I/O options. It is suitable for a variety of applications, including embedded systems, industrial automation, medical electronics, automotive electronics, and communications systems.



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