M4A3-256/192-10FAI
M4A3-256/192-10FAI
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Lattice Semiconductor Corporation

M4A3-256/192-10FAI


M4A3-256/192-10FAI
F11-M4A3-256/192-10FAI
Active
IC CPLD 256MC 10NS 256FBGA
256-FPBGA (17x17)

M4A3-256/192-10FAI ECAD Model


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M4A3-256/192-10FAI Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispMACH® 4A
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 10 ns
Voltage Supply - Internal 3V ~ 3.6V
Number of Macrocells 256
Number of I/O 192
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number M4A3-256

M4A3-256/192-10FAI Datasheet Download


M4A3-256/192-10FAI Overview



The M4A3-256/192-10FAI is a high-performance, low-power, and cost-effective memory chip designed for a wide range of applications. It is a dual-channel memory chip with a total capacity of 256 megabytes (MB) and 192 megabits (Mb) of storage. The chip is based on a 10 nanometer (nm) FinFET process technology, which enables high-speed operation and energy efficiency.


The M4A3-256/192-10FAI features an advanced low-power design, which helps to reduce power consumption and extend battery life. It also offers a wide range of features, such as error correction, data protection, and power management. The chip is capable of supporting multiple data transfer protocols, including DDR3, DDR4, and LPDDR4. It also supports multiple memory types, including SRAM, DRAM, and FLASH.


The M4A3-256/192-10FAI is suitable for a variety of applications, such as mobile devices, servers, embedded systems, and automotive applications. It is also suitable for applications that require high-speed data transfer, such as gaming and virtual reality. Additionally, the chip has been designed to be compatible with the latest industry standards, such as the JEDEC, OpenCL, and OpenMP.


In summary, the M4A3-256/192-10FAI is a high-performance, low-power, and cost-effective memory chip designed for a wide range of applications. It is based on a 10nm FinFET process technology, which enables high-speed operation and energy efficiency. The chip is capable of supporting multiple data transfer protocols, memory types, and industry standards. It is suitable for a variety of applications, including mobile devices, servers, embedded systems, and automotive applications.



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