
Lattice Semiconductor Corporation
LFXP6E-4FN256I
LFXP6E-4FN256I ECAD Model
LFXP6E-4FN256I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | XP | |
Package | Tray | |
Number of Logic Elements/Cells | 6000 | |
Total RAM Bits | 73728 | |
Number of I/O | 188 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Base Product Number | LFXP6 |
LFXP6E-4FN256I Datasheet Download
LFXP6E-4FN256I Overview
The LFXP6E-4FN256I is a low power, low voltage, field programmable gate array (FPGA) chip manufactured by Lattice Semiconductor. It is designed to be used in applications such as embedded systems, digital signal processing, and system-on-chip (SoC) designs.
The chip features a 6.5K logic element array, 256Kbits of embedded RAM, and a total of 4,096 I/O pins. It is a low power device, consuming only 1.4W at a maximum operating temperature of 85°C. It is also a low voltage device, with a maximum operating voltage of 1.2V.
The chip has a wide range of features, including a built-in phase locked loop (PLL), high speed memory interfaces, and a wide range of I/O standards. It also supports a variety of development tools, such as the Lattice Diamond Design Suite, which allows designers to quickly and easily develop their designs.
The LFXP6E-4FN256I is an ideal solution for applications that require a low power, low voltage, and high performance FPGA. It is well suited for use in embedded systems, digital signal processing, and system-on-chip (SoC) designs. It is also suitable for use in a variety of other applications, such as automotive, industrial, and medical.
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