LFXP6E-3TN144I
LFXP6E-3TN144I
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Lattice Semiconductor Corporation

LFXP6E-3TN144I


LFXP6E-3TN144I
XP
F11-LFXP6E-3TN144I
Active
IC FPGA 100 I/O 144TQFP
144-TQFP (20x20)

LFXP6E-3TN144I ECAD Model


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LFXP6E-3TN144I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series XP
Package Tray
Number of Logic Elements/Cells 6000
Total RAM Bits 73728
Number of I/O 100
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Base Product Number LFXP6

LFXP6E-3TN144I Datasheet Download


LFXP6E-3TN144I Overview



The LFXP6E-3TN144I is a low-cost, low-power FPGA (Field Programmable Gate Array) chip manufactured by Lattice Semiconductor Corporation. It is a 6-input, 3-output device with a 144-pin TQFP (Thin Quad Flat Pack) package. This chip is designed for applications such as digital signal processing, embedded system design, and automotive control systems.


The LFXP6E-3TN144I features a low-power, low-cost FPGA architecture, with 6-input and 3-output pin configurations. It is capable of supporting up to 8,192 logic elements, including 18Kbits of embedded memory. The device also includes four dedicated I/O banks, each with up to 36 dedicated I/O pins. It has a maximum operating frequency of up to 100 MHz and a maximum power dissipation of 1.2W.


The LFXP6E-3TN144I is suitable for a wide range of applications, including digital signal processing, embedded system design, automotive control systems, and other industrial applications. It is capable of providing reliable performance in a wide range of operating conditions, including temperatures ranging from -40°C to +85°C. Additionally, the device offers a wide range of features, including low-cost, low-power operation, high-speed performance, and a wide range of I/O pins.


In conclusion, the LFXP6E-3TN144I is a low-cost, low-power FPGA chip with 6-input and 3-output pin configurations. It is designed for applications such as digital signal processing, embedded system design, and automotive control systems. The device offers reliable performance in a wide range of operating conditions, and provides a wide range of features, including low-cost, low-power operation, high-speed performance, and a wide range of I/O pins.



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