LFXP6C-4FN256C
LFXP6C-4FN256C
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Lattice Semiconductor Corporation

LFXP6C-4FN256C


LFXP6C-4FN256C
XP
F11-LFXP6C-4FN256C
Active
IC FPGA 188 I/O 256FBGA
256-FPBGA (17x17)

LFXP6C-4FN256C ECAD Model


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LFXP6C-4FN256C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series XP
Package Tray
Number of Logic Elements/Cells 6000
Total RAM Bits 73728
Number of I/O 188
Voltage - Supply 1.71V ~ 3.465V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFXP6

LFXP6C-4FN256C Datasheet Download


LFXP6C-4FN256C Overview



The LFXP6C-4FN256C is a low-power, low-cost, low-voltage FPGA (field-programmable gate array) chip from Lattice Semiconductor. It is a member of the LatticeXP family of FPGAs and is designed for high-performance applications such as embedded systems, automotive, industrial, and medical applications.


The LFXP6C-4FN256C chip is manufactured using the 0.15 μm CMOS process technology, and has a total of 256 logic cells and 4Kbits of RAM. It has a total of 18 I/O pins, with a maximum operating voltage of 1.8V and a maximum operating frequency of 150 MHz. It also has an integrated oscillator, clock generator, and phase-locked loop (PLL) circuits.


The LFXP6C-4FN256C chip is designed for low-power applications, and features an integrated power management block which can reduce power consumption by up to 50%. It also has an integrated thermal management system which helps to keep the chip cool during high-performance operations.


The LFXP6C-4FN256C chip is suitable for a wide range of applications, such as digital signal processing, video processing, networking, and communications. It is also suitable for applications requiring low-power, low-cost, and low-voltage solutions. Additionally, it is ideal for embedded systems, automotive, industrial, and medical applications.



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