LFXP20C-3FN256I
LFXP20C-3FN256I
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Lattice Semiconductor Corporation

LFXP20C-3FN256I


LFXP20C-3FN256I
XP
F11-LFXP20C-3FN256I
Active
IC FPGA 188 I/O 256FBGA
256-FPBGA (17x17)

LFXP20C-3FN256I ECAD Model


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LFXP20C-3FN256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series XP
Package Tray
Number of Logic Elements/Cells 20000
Total RAM Bits 405504
Number of I/O 188
Voltage - Supply 1.71V ~ 3.465V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFXP20

LFXP20C-3FN256I Datasheet Download


LFXP20C-3FN256I Overview



The LFXP20C-3FN256I is a low-cost, low-power, high-performance field programmable gate array (FPGA) chip from Lattice Semiconductor Corporation. It is designed for a wide range of applications, including embedded systems, industrial automation, automotive and consumer electronics.


The chip features a 256-bit architecture and is capable of delivering up to 20 million system gates. It is equipped with two high-speed clock inputs, four general-purpose I/O ports, and up to 32Kbits of embedded memory. It also includes a dedicated JTAG port for programming and debugging.


The chip is manufactured using a 0.18-micron process technology, and is available in a range of package sizes, from 144-pin to 256-pin. It is rated to operate at temperatures from -40°C to +85°C, and has a maximum power dissipation of 1.5W.


The LFXP20C-3FN256I is designed to meet the needs of a wide range of applications, including embedded systems, industrial automation, automotive, and consumer electronics. It is ideal for applications requiring low power, high performance, and cost-effective solutions. It is also suitable for applications requiring high-speed clock inputs, general-purpose I/O ports, and embedded memory.



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