
Lattice Semiconductor Corporation
LFXP20C-3FN256I
LFXP20C-3FN256I ECAD Model
LFXP20C-3FN256I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | XP | |
Package | Tray | |
Number of Logic Elements/Cells | 20000 | |
Total RAM Bits | 405504 | |
Number of I/O | 188 | |
Voltage - Supply | 1.71V ~ 3.465V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Base Product Number | LFXP20 |
LFXP20C-3FN256I Datasheet Download
LFXP20C-3FN256I Overview
The LFXP20C-3FN256I is a low-cost, low-power, high-performance field programmable gate array (FPGA) chip from Lattice Semiconductor Corporation. It is designed for a wide range of applications, including embedded systems, industrial automation, automotive and consumer electronics.
The chip features a 256-bit architecture and is capable of delivering up to 20 million system gates. It is equipped with two high-speed clock inputs, four general-purpose I/O ports, and up to 32Kbits of embedded memory. It also includes a dedicated JTAG port for programming and debugging.
The chip is manufactured using a 0.18-micron process technology, and is available in a range of package sizes, from 144-pin to 256-pin. It is rated to operate at temperatures from -40°C to +85°C, and has a maximum power dissipation of 1.5W.
The LFXP20C-3FN256I is designed to meet the needs of a wide range of applications, including embedded systems, industrial automation, automotive, and consumer electronics. It is ideal for applications requiring low power, high performance, and cost-effective solutions. It is also suitable for applications requiring high-speed clock inputs, general-purpose I/O ports, and embedded memory.
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