
Lattice Semiconductor Corporation
LFXP2-30E-6FTN256C
LFXP2-30E-6FTN256C ECAD Model
LFXP2-30E-6FTN256C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | XP2 | |
Package | Tray | |
Number of LABs/CLBs | 3625 | |
Number of Logic Elements/Cells | 29000 | |
Total RAM Bits | 396288 | |
Number of I/O | 201 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-FTBGA (17x17) | |
Base Product Number | LFXP2-30 |
LFXP2-30E-6FTN256C Datasheet Download
LFXP2-30E-6FTN256C Overview
The LFXP2-30E-6FTN256C is a low power, low voltage field programmable gate array (FPGA) chip designed and manufactured by Lattice Semiconductor. It is a member of the LatticeXP2 family, which is a family of FPGAs designed for low power applications. The chip has a capacity of 256Kbits and is based on the LatticeXP2-30E architecture. It has a maximum operating frequency of up to 300MHz, a maximum power consumption of 1.3W, and a maximum operating temperature of 85°C.
The chip features an array of programmable logic blocks and embedded memory blocks, as well as a range of I/O and clock management functions. It also includes a range of advanced features such as differential signal support, clock management, and low-power design. It is designed to be used in a variety of applications, including automotive, industrial, medical, and consumer electronics.
The chip is housed in a 6x6mm, 0.5mm pitch, 256-ball BGA package. It is also available in a range of other packages, including a 6x6mm, 0.4mm pitch, 256-ball BGA package, and a 6x6mm, 0.5mm pitch, 256-ball VFBGA package. The chip is RoHS-compliant and is compatible with a range of industry-standard development tools, including the Lattice Diamond design software.
In summary, the LFXP2-30E-6FTN256C is a low power, low voltage FPGA chip designed for a variety of applications. It has a capacity of 256Kbits, a maximum operating frequency of up to 300MHz, and a maximum power consumption of 1.3W. It is housed in a 6x6mm, 0.5mm pitch, 256-ball BGA package and is compatible with a range of industry-standard development tools.
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5,245 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $87.9783 | $87.9783 |
10+ | $87.0323 | $870.3228 |
100+ | $82.3023 | $8,230.2261 |
1000+ | $77.5722 | $38,786.1230 |
10000+ | $70.9502 | $70,950.2250 |
The price is for reference only, please refer to the actual quotation! |