LFXP2-30E-6FTN256C
LFXP2-30E-6FTN256C
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rohs

Lattice Semiconductor Corporation

LFXP2-30E-6FTN256C


LFXP2-30E-6FTN256C
XP2
F11-LFXP2-30E-6FTN256C
Active
IC FPGA 201 I/O 256FTBGA
256-FTBGA (17x17)

LFXP2-30E-6FTN256C ECAD Model


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LFXP2-30E-6FTN256C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series XP2
Package Tray
Number of LABs/CLBs 3625
Number of Logic Elements/Cells 29000
Total RAM Bits 396288
Number of I/O 201
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number LFXP2-30

LFXP2-30E-6FTN256C Datasheet Download


LFXP2-30E-6FTN256C Overview



The LFXP2-30E-6FTN256C is a low power, low voltage field programmable gate array (FPGA) chip designed and manufactured by Lattice Semiconductor. It is a member of the LatticeXP2 family, which is a family of FPGAs designed for low power applications. The chip has a capacity of 256Kbits and is based on the LatticeXP2-30E architecture. It has a maximum operating frequency of up to 300MHz, a maximum power consumption of 1.3W, and a maximum operating temperature of 85°C.


The chip features an array of programmable logic blocks and embedded memory blocks, as well as a range of I/O and clock management functions. It also includes a range of advanced features such as differential signal support, clock management, and low-power design. It is designed to be used in a variety of applications, including automotive, industrial, medical, and consumer electronics.


The chip is housed in a 6x6mm, 0.5mm pitch, 256-ball BGA package. It is also available in a range of other packages, including a 6x6mm, 0.4mm pitch, 256-ball BGA package, and a 6x6mm, 0.5mm pitch, 256-ball VFBGA package. The chip is RoHS-compliant and is compatible with a range of industry-standard development tools, including the Lattice Diamond design software.


In summary, the LFXP2-30E-6FTN256C is a low power, low voltage FPGA chip designed for a variety of applications. It has a capacity of 256Kbits, a maximum operating frequency of up to 300MHz, and a maximum power consumption of 1.3W. It is housed in a 6x6mm, 0.5mm pitch, 256-ball BGA package and is compatible with a range of industry-standard development tools.



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Unit Price: $94.6003
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Pricing (USD)

QTY Unit Price Ext Price
1+ $87.9783 $87.9783
10+ $87.0323 $870.3228
100+ $82.3023 $8,230.2261
1000+ $77.5722 $38,786.1230
10000+ $70.9502 $70,950.2250
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