LFXP2-17E-6FT256C
LFXP2-17E-6FT256C
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Lattice Semiconductor Corporation

LFXP2-17E-6FT256C


LFXP2-17E-6FT256C
XP2
F11-LFXP2-17E-6FT256C
Active
IC FPGA 201 I/O 256FTBGA
256-FTBGA (17x17)

LFXP2-17E-6FT256C ECAD Model


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LFXP2-17E-6FT256C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series XP2
Package Tray
Number of LABs/CLBs 2125
Number of Logic Elements/Cells 17000
Total RAM Bits 282624
Number of I/O 201
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number LFXP2-17

LFXP2-17E-6FT256C Datasheet Download


LFXP2-17E-6FT256C Overview



The LFXP2-17E-6FT256C is a low-power, low-voltage, low-cost, FPGA (Field Programmable Gate Array) chip. It is designed to be used in a wide range of applications in the industrial, automotive, medical, and consumer markets.


This chip is based on the Xilinx Spartan-6 FPGA family, and it is fabricated using the 65nm process technology. It has a total of 17,600 logic cells and 256Kb of block RAM. It also has 48 DSP slices, four clock management tiles, and two I/O banks. In addition, it has a total of 256 user I/O pins, which can be configured to support a variety of different interfaces, such as LVTTL, LVCMOS, SSTL, and HSTL.


The LFXP2-17E-6FT256C is designed to operate at a maximum speed of up to 200MHz, and it has a power consumption of only 2.5W. It has a wide operating temperature range of -40°C to +85°C, making it suitable for a variety of different applications.


The LFXP2-17E-6FT256C is ideal for applications such as embedded system design, motor control, communication systems, industrial automation, and medical instrumentation. It is capable of performing a variety of tasks, including signal processing, data acquisition, and control. Its low power consumption and wide operating temperature range make it suitable for use in battery-operated and extreme temperature environments.



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