LFXP10E-3FN256I
LFXP10E-3FN256I
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Lattice Semiconductor Corporation

LFXP10E-3FN256I


LFXP10E-3FN256I
XP
F11-LFXP10E-3FN256I
Active
IC FPGA 188 I/O 256FBGA
256-FPBGA (17x17)

LFXP10E-3FN256I ECAD Model


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LFXP10E-3FN256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series XP
Package Tray
Number of Logic Elements/Cells 10000
Total RAM Bits 221184
Number of I/O 188
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFXP10

LFXP10E-3FN256I Datasheet Download


LFXP10E-3FN256I Overview



The LFXP10E-3FN256I is a low-power, low-cost, high-performance FPGA chip manufactured by Lattice Semiconductor. It is designed to provide a wide range of features and capabilities in a small form factor. It is suitable for a variety of applications, including embedded systems, consumer electronics, automotive, industrial, and medical.


The LFXP10E-3FN256I features an 8-bit RISC processor core with a maximum clock speed of up to 200 MHz, 256 KB of on-chip SRAM, and an on-chip flash memory of up to 2 MB. It also has a number of peripherals, including USB, UART, I2C, SPI, and GPIO. It supports a wide range of operating systems, including Linux, Windows, and Android.


The LFXP10E-3FN256I is designed to provide low power consumption, making it suitable for battery-powered applications. It also features advanced power management capabilities, including power-saving modes and clock gating. It is also designed to be highly reliable and robust, with built-in error correction and fault tolerance.


In terms of specifications, the LFXP10E-3FN256I has a total power consumption of 1.2 W, a voltage range of 1.2 V to 3.3 V, and a temperature range of -40°C to +85°C. It also has a package size of 10 x 10 mm, making it suitable for space-constrained applications.


Overall, the LFXP10E-3FN256I is a low-power, low-cost, high-performance FPGA chip that is suitable for a wide range of applications. It features a powerful processor core, a wide range of peripherals, and advanced power management capabilities. It is also designed to provide reliable and robust performance, making it suitable for a variety of embedded and consumer applications.



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