LFXP10E-3F256I
LFXP10E-3F256I
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rohs

Lattice Semiconductor Corporation

LFXP10E-3F256I


LFXP10E-3F256I
XP
F11-LFXP10E-3F256I
Active
IC FPGA 188 I/O 256FBGA
256-FPBGA (17x17)

LFXP10E-3F256I ECAD Model


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LFXP10E-3F256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series XP
Package Tray
Number of Logic Elements/Cells 10000
Total RAM Bits 221184
Number of I/O 188
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFXP10

LFXP10E-3F256I Datasheet Download


LFXP10E-3F256I Overview



The LFXP10E-3F256I is a low-power, high-performance FPGA (Field Programmable Gate Array) chip model from Lattice Semiconductor Corporation. The chip is based on the LatticeXP2-3 FPGA family and offers 256 logic cells, up to 8Kbits of embedded memory, and a wide range of digital signal processing capabilities. It also features a high-speed serial interface, low-power operation, and a wide range of I/O options.


The LFXP10E-3F256I can be used in a variety of applications such as industrial automation, medical imaging, automotive applications, consumer electronics, and embedded systems. It is suitable for applications that require high performance, low power consumption, and a wide range of I/O options.


The chip is capable of operating at a maximum speed of 100 MHz, and can be configured with up to 256 logic cells. It has a wide range of I/O options, including LVDS, LVCMOS, and LVTTL. The chip also features an 8Kbits of embedded memory, as well as a high-speed serial interface.


The chip is designed to operate in a wide range of temperatures and voltages, and is compliant with RoHS and WEEE standards. It is also designed to be used in a variety of industrial, medical, and consumer applications.


Overall, the LFXP10E-3F256I is a low-power, high-performance FPGA chip model that is suitable for a wide range of applications. It offers 256 logic cells, up to 8Kbits of embedded memory, and a wide range of I/O options. It is designed to operate in a wide range of temperatures and voltages, and is compliant with RoHS and WEEE standards.



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