LFX200EB-03F256I
LFX200EB-03F256I
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Lattice Semiconductor Corporation

LFX200EB-03F256I


LFX200EB-03F256I
F11-LFX200EB-03F256I
Active
IC FPGA 160 I/O 256FBGA
256-FPBGA (17x17)

LFX200EB-03F256I ECAD Model


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LFX200EB-03F256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispXPGA®
Package Tray
Number of Logic Elements/Cells 2704
Total RAM Bits 113664
Number of I/O 160
Number of Gates 210000
Voltage - Supply 2.3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFX200

LFX200EB-03F256I Datasheet Download


LFX200EB-03F256I Overview



The LFX200EB-03F256I is a low power, high performance, and highly integrated System-on-Chip (SoC) designed for embedded applications. It is based on the ARM Cortex-A9 processor and includes a 256MB DDR3 SDRAM. The SoC also features a powerful 3D graphics processor, a video decoder, and a wide range of peripherals.


The LFX200EB-03F256I is built on a 65nm CMOS process and has a maximum operating frequency of 1.2GHz. It has a power consumption of just 1.5W and a maximum clock frequency of 1.2GHz. The SoC also features a wide range of peripherals including USB 2.0, Ethernet, UART, I2C, SPI, and GPIO.


The LFX200EB-03F256I is suitable for a wide range of embedded applications such as industrial automation, consumer electronics, automotive, medical, and military. It is also ideal for applications that require low power consumption and high performance.


The LFX200EB-03F256I is a highly integrated SoC that offers a wide range of features and performance. It is suitable for a wide range of embedded applications that require low power consumption and high performance. It is also ideal for applications that require a wide range of peripherals and 3D graphics capabilities.



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