
Lattice Semiconductor Corporation
LFX200EB-03F256I
LFX200EB-03F256I ECAD Model
LFX200EB-03F256I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ispXPGA® | |
Package | Tray | |
Number of Logic Elements/Cells | 2704 | |
Total RAM Bits | 113664 | |
Number of I/O | 160 | |
Number of Gates | 210000 | |
Voltage - Supply | 2.3V ~ 3.6V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 105°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Base Product Number | LFX200 |
LFX200EB-03F256I Datasheet Download
LFX200EB-03F256I Overview
The LFX200EB-03F256I is a low power, high performance, and highly integrated System-on-Chip (SoC) designed for embedded applications. It is based on the ARM Cortex-A9 processor and includes a 256MB DDR3 SDRAM. The SoC also features a powerful 3D graphics processor, a video decoder, and a wide range of peripherals.
The LFX200EB-03F256I is built on a 65nm CMOS process and has a maximum operating frequency of 1.2GHz. It has a power consumption of just 1.5W and a maximum clock frequency of 1.2GHz. The SoC also features a wide range of peripherals including USB 2.0, Ethernet, UART, I2C, SPI, and GPIO.
The LFX200EB-03F256I is suitable for a wide range of embedded applications such as industrial automation, consumer electronics, automotive, medical, and military. It is also ideal for applications that require low power consumption and high performance.
The LFX200EB-03F256I is a highly integrated SoC that offers a wide range of features and performance. It is suitable for a wide range of embedded applications that require low power consumption and high performance. It is also ideal for applications that require a wide range of peripherals and 3D graphics capabilities.
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