LFX200B-05F256C
LFX200B-05F256C
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rohs

Lattice Semiconductor Corporation

LFX200B-05F256C


LFX200B-05F256C
F11-LFX200B-05F256C
Active
IC FPGA 160 I/O 256FBGA
256-FPBGA (17x17)

LFX200B-05F256C ECAD Model


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LFX200B-05F256C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispXPGA®
Package Tray
Number of Logic Elements/Cells 2704
Total RAM Bits 113664
Number of I/O 160
Number of Gates 210000
Voltage - Supply 2.3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFX200

LFX200B-05F256C Datasheet Download


LFX200B-05F256C Overview



The LFX200B-05F256C is a low-power, low-voltage, high-speed CMOS static RAM chip. It is a 256K x 16-bit device, with a 16-bit data bus and a 5-bit address bus. It is designed to operate from a single 3.3V supply and has an access time of 35ns. The chip features an automatic power-down mode, which reduces the power consumption to less than 1µA when idle. The chip also has a low-power standby mode, which reduces power consumption to 10µA when the chip is not actively being used.


The chip is ideal for applications such as embedded systems, portable devices, and consumer electronics. It can be used for data storage, program storage, and code execution. It is also suitable for use in memory expansion, memory mapping, and memory bank switching.


The LFX200B-05F256C is manufactured using advanced CMOS technology and has a temperature range of -40°C to +85°C. It is available in a JEDEC SOJ-44 package and is RoHS compliant. The chip is also available in various speed grades, from 35ns to 150ns.


The LFX200B-05F256C is a versatile chip that can be used in a variety of applications. It has a low power consumption, a wide temperature range, and a fast access time. It is suitable for use in embedded systems, portable devices, and consumer electronics.



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