
Lattice Semiconductor Corporation
LFX200B-03FN256C
LFX200B-03FN256C ECAD Model
LFX200B-03FN256C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ispXPGA® | |
Package | Tray | |
Number of Logic Elements/Cells | 2704 | |
Total RAM Bits | 113664 | |
Number of I/O | 160 | |
Number of Gates | 210000 | |
Voltage - Supply | 2.3V ~ 3.6V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Base Product Number | LFX200 |
LFX200B-03FN256C Datasheet Download
LFX200B-03FN256C Overview
The LFX200B-03FN256C is an FPGA chip manufactured by Lattice Semiconductor Corporation. It is a low-power, low-cost, field-programmable gate array (FPGA) device that can be used to implement a wide range of digital functions. It is designed for applications requiring high-performance, low-power, and low-cost solutions.
The LFX200B-03FN256C is a 256-pin device with a maximum operating frequency of up to 200 MHz. It has a total of 256 logic cells, each with 4 input/output pins. The device also features a wide range of I/O options, including LVDS, LVCMOS, and SGMII. It supports up to 8 Kbits of embedded Flash memory and up to 4 Kbits of SRAM.
The LFX200B-03FN256C is suitable for a variety of applications, including industrial automation, medical, automotive, consumer electronics, and communications. It can be used for signal processing, image processing, logic control, and protocol conversion. The device is also ideal for applications requiring low power consumption and high-speed operation.
In summary, the LFX200B-03FN256C is a low-power, low-cost FPGA device with a maximum operating frequency of up to 200 MHz. It features a wide range of I/O options, embedded Flash memory, and SRAM. The device is suitable for a variety of applications, including industrial automation, medical, automotive, consumer electronics, and communications.
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Pricing (USD)
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