LFX200B-03FN256C
LFX200B-03FN256C
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Lattice Semiconductor Corporation

LFX200B-03FN256C


LFX200B-03FN256C
F11-LFX200B-03FN256C
Active
IC FPGA 160 I/O 256FBGA
256-FPBGA (17x17)

LFX200B-03FN256C ECAD Model


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LFX200B-03FN256C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispXPGA®
Package Tray
Number of Logic Elements/Cells 2704
Total RAM Bits 113664
Number of I/O 160
Number of Gates 210000
Voltage - Supply 2.3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFX200

LFX200B-03FN256C Datasheet Download


LFX200B-03FN256C Overview



The LFX200B-03FN256C is an FPGA chip manufactured by Lattice Semiconductor Corporation. It is a low-power, low-cost, field-programmable gate array (FPGA) device that can be used to implement a wide range of digital functions. It is designed for applications requiring high-performance, low-power, and low-cost solutions.


The LFX200B-03FN256C is a 256-pin device with a maximum operating frequency of up to 200 MHz. It has a total of 256 logic cells, each with 4 input/output pins. The device also features a wide range of I/O options, including LVDS, LVCMOS, and SGMII. It supports up to 8 Kbits of embedded Flash memory and up to 4 Kbits of SRAM.


The LFX200B-03FN256C is suitable for a variety of applications, including industrial automation, medical, automotive, consumer electronics, and communications. It can be used for signal processing, image processing, logic control, and protocol conversion. The device is also ideal for applications requiring low power consumption and high-speed operation.


In summary, the LFX200B-03FN256C is a low-power, low-cost FPGA device with a maximum operating frequency of up to 200 MHz. It features a wide range of I/O options, embedded Flash memory, and SRAM. The device is suitable for a variety of applications, including industrial automation, medical, automotive, consumer electronics, and communications.



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