LFSCM3GA80EP1-7FFN1704C
LFSCM3GA80EP1-7FFN1704C
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Lattice Semiconductor Corporation

LFSCM3GA80EP1-7FFN1704C


LFSCM3GA80EP1-7FFN1704C
SCM
F11-LFSCM3GA80EP1-7FFN1704C
Active
IC FPGA 904 I/O 1704FCBGA
1704-OFCBGA (42.5x42.5)

LFSCM3GA80EP1-7FFN1704C ECAD Model


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LFSCM3GA80EP1-7FFN1704C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 20000
Number of Logic Elements/Cells 80000
Total RAM Bits 5816320
Number of I/O 904
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1704-BBGA, FCBGA
Supplier Device Package 1704-OFCBGA (42.5x42.5)
Base Product Number LFSCM3GA80

LFSCM3GA80EP1-7FFN1704C Datasheet Download


LFSCM3GA80EP1-7FFN1704C Overview



The LFSCM3GA80EP1-7FFN1704C is a chip model manufactured by STMicroelectronics. It is a low-frequency system-on-chip (SoC) that combines a 32-bit ARM Cortex-M3 processor with a variety of peripherals, including an analog-to-digital converter (ADC) and digital-to-analog converter (DAC). The SoC also features an embedded Flash memory and SRAM, as well as a range of communication interfaces, including USB, I2C, SPI, and UART.


The chip model is designed for use in embedded systems and is suitable for a range of applications, including industrial automation, home automation, medical devices, and automotive systems. It offers a low-power solution for applications that require high performance and low latency. The chip model is also suitable for use in applications that require real-time processing and reliable data transfer.


The LFSCM3GA80EP1-7FFN1704C is available in a 7x7 mm QFN package and operates at a voltage range of 1.8 to 3.6V. It has a maximum clock frequency of 80MHz and can support up to 256KB of Flash memory and 32KB of SRAM. The chip model also supports a wide range of communication protocols, including CAN, LIN, and Ethernet.


In summary, the LFSCM3GA80EP1-7FFN1704C is a low-frequency SoC that combines a 32-bit ARM Cortex-M3 processor with a range of peripherals and communication interfaces. It is suitable for use in a variety of embedded applications, such as industrial automation, home automation, medical devices, and automotive systems. The chip model is available in a 7x7 mm QFN package and offers a low-power solution with high performance and low latency.



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