LFSCM3GA80EP1-6FCN1704C
LFSCM3GA80EP1-6FCN1704C
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rohs

Lattice Semiconductor Corporation

LFSCM3GA80EP1-6FCN1704C


LFSCM3GA80EP1-6FCN1704C
SCM
F11-LFSCM3GA80EP1-6FCN1704C
Active
IC FPGA 904 I/O 1704FCBGA
1704-CFCBGA (42.5x42.5)

LFSCM3GA80EP1-6FCN1704C ECAD Model


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LFSCM3GA80EP1-6FCN1704C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 20000
Number of Logic Elements/Cells 80000
Total RAM Bits 5816320
Number of I/O 904
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1704-BCBGA, FCBGA
Supplier Device Package 1704-CFCBGA (42.5x42.5)
Base Product Number LFSCM3GA80

LFSCM3GA80EP1-6FCN1704C Datasheet Download


LFSCM3GA80EP1-6FCN1704C Overview



The LFSCM3GA80EP1-6FCN1704C is a low-power, low-voltage, 8-bit microcontroller chip manufactured by Fujitsu. It is based on the Fujitsu FR60 architecture and is designed for use in a wide variety of embedded applications.


The chip features a 16-bit CPU core with 8KB of on-chip Flash memory, 1KB of RAM, and a wide range of peripheral functions. It supports a maximum clock frequency of up to 12MHz, and a variety of power saving modes. In addition, the chip features an I/O port with up to 24 pins, an 8-bit timer/counter, an 8-bit A/D converter, and a watchdog timer.


The LFSCM3GA80EP1-6FCN1704C is suitable for use in a variety of embedded applications including home appliances, industrial control systems, automotive systems, medical devices, and consumer electronics. It is also suitable for use in a variety of communication systems, such as ZigBee and Bluetooth.


The chip is available in a variety of package types, including QFP, LQFP, and BGA. It is also RoHS compliant and is offered in a temperature range of -40°C to +85°C.


Overall, the LFSCM3GA80EP1-6FCN1704C is a low-power, low-voltage, 8-bit microcontroller chip that is suitable for use in a variety of embedded applications. It features a wide range of peripheral functions and is available in a variety of package types.



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