LFSCM3GA115EP1-6FCN1704I
LFSCM3GA115EP1-6FCN1704I
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Lattice Semiconductor Corporation

LFSCM3GA115EP1-6FCN1704I


LFSCM3GA115EP1-6FCN1704I
SCM
F11-LFSCM3GA115EP1-6FCN1704I
Active
IC FPGA 942 I/O 1704FCBGA
1704-CFCBGA (42.5x42.5)

LFSCM3GA115EP1-6FCN1704I ECAD Model


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LFSCM3GA115EP1-6FCN1704I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 28750
Number of Logic Elements/Cells 115000
Total RAM Bits 7987200
Number of I/O 942
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 1704-BCBGA, FCBGA
Supplier Device Package 1704-CFCBGA (42.5x42.5)
Base Product Number LFSCM3GA115

LFSCM3GA115EP1-6FCN1704I Datasheet Download


LFSCM3GA115EP1-6FCN1704I Overview



The LFSCM3GA115EP1-6FCN1704I is a chip model developed by Fujitsu for use in their embedded systems. It is a low-power, low-cost, full-function System-on-Chip (SoC) designed for embedded applications. The chip integrates a 32-bit ARM Cortex-M3 processor, a wide range of peripherals, and a variety of memory options, including SRAM and Flash.


The chip is designed to be power-efficient, with a low-power sleep mode and a wide operating voltage range of 1.6 V to 3.6 V. It also has a wide temperature range of -40°C to 85°C, making it suitable for a variety of environmental conditions. The chip also features a high-speed SPI interface, a UART interface, and a CAN bus interface.


The LFSCM3GA115EP1-6FCN1704I is suitable for a wide range of applications, including industrial automation, medical devices, home appliances, and automotive applications. It can also be used in a variety of embedded systems, such as IoT devices, wearable devices, and embedded controllers.


The LFSCM3GA115EP1-6FCN1704I is an ideal choice for embedded applications that require low-power and low-cost solutions. It is a highly integrated SoC with a wide range of features and peripherals, making it suitable for a variety of applications.



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