LFSCM3GA115EP1-5FCN1704C
LFSCM3GA115EP1-5FCN1704C
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Lattice Semiconductor Corporation

LFSCM3GA115EP1-5FCN1704C


LFSCM3GA115EP1-5FCN1704C
SCM
F11-LFSCM3GA115EP1-5FCN1704C
Active
IC FPGA 942 I/O 1704FCBGA
1704-CFCBGA (42.5x42.5)

LFSCM3GA115EP1-5FCN1704C ECAD Model


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LFSCM3GA115EP1-5FCN1704C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SCM
Package Tray
Number of LABs/CLBs 28750
Number of Logic Elements/Cells 115000
Total RAM Bits 7987200
Number of I/O 942
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1704-BCBGA, FCBGA
Supplier Device Package 1704-CFCBGA (42.5x42.5)
Base Product Number LFSCM3GA115

LFSCM3GA115EP1-5FCN1704C Datasheet Download


LFSCM3GA115EP1-5FCN1704C Overview



The LFSCM3GA115EP1-5FCN1704C is a multi-core processor chip designed by Fujitsu Semiconductor. It is a single-chip solution that combines a high-performance processor core with a wide range of peripheral functions. The processor core is based on the ARM Cortex-A15 architecture, which delivers a powerful performance in a low power consumption. The processor core is clocked at up to 1.5GHz and has a 32-bit memory interface. It also supports up to 4GB of LPDDR3 RAM.


The chip also features a wide range of peripheral functions, including an integrated graphics processor, audio codec, Ethernet PHY, USB, and UART. It also features a wide range of power management features, such as dynamic voltage and frequency scaling (DVFS) and adaptive power management (APM).


The LFSCM3GA115EP1-5FCN1704C is suitable for a wide range of applications, including embedded systems, industrial automation, automotive, and consumer electronics. It is suitable for use in high-performance computing systems, as well as low-power, low-cost applications. It is also suitable for applications where power efficiency and low-cost are essential.


Overall, the LFSCM3GA115EP1-5FCN1704C is a powerful and cost-effective processor chip that is suitable for a wide range of applications. It is capable of delivering a high-performance while consuming low power. It is also highly integrated, which reduces the cost and complexity of the system design.



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