LFSC3GA115E-5FC1704C
LFSC3GA115E-5FC1704C
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Lattice Semiconductor Corporation

LFSC3GA115E-5FC1704C


LFSC3GA115E-5FC1704C
SC
F11-LFSC3GA115E-5FC1704C
Active
IC FPGA 942 I/O 1704FCBGA
1704-CFCBGA (42.5x42.5)

LFSC3GA115E-5FC1704C ECAD Model


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LFSC3GA115E-5FC1704C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series SC
Package Tray
Number of LABs/CLBs 28750
Number of Logic Elements/Cells 115000
Total RAM Bits 7987200
Number of I/O 942
Voltage - Supply 0.95V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1704-BCBGA, FCBGA
Supplier Device Package 1704-CFCBGA (42.5x42.5)
Base Product Number LFSC3GA115

LFSC3GA115E-5FC1704C Datasheet Download


LFSC3GA115E-5FC1704C Overview



The LFSC3GA115E-5FC1704C is an integrated circuit (IC) chip manufactured by Texas Instruments. It is a low-power, low-cost, single-channel, 3-GHz RF front-end for Wi-Fi and Bluetooth applications. This chip is designed for use in mobile devices such as smartphones, tablets, and laptops.


The LFSC3GA115E-5FC1704C features a low-noise amplifier (LNA), a power amplifier (PA), and a switch. The LNA has a noise figure of less than 1.5 dB, a gain of 15 dB, and a linearity of up to +30 dBm. The PA has a power output of up to +17 dBm and a linearity of up to +30 dBm. The switch has an insertion loss of less than 0.5 dB.


The chip is designed to operate in the 3-GHz frequency range and supports Wi-Fi and Bluetooth protocols. It is also compliant with the IEEE 802.11b/g/n/ac standards. The chip has an on-chip temperature sensor and is capable of operating in temperatures ranging from -40°C to +85°C.


The LFSC3GA115E-5FC1704C can be used in a variety of applications, including wireless local area networks (WLANs), Bluetooth Low Energy (BLE) networks, and wireless personal area networks (WPANs). It can also be used for wireless audio applications such as headsets, speakers, and microphones. The chip is ideal for use in mobile devices due to its low power consumption and small size.



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