
Lattice Semiconductor Corporation
LFECP6E-4TN144I
LFECP6E-4TN144I ECAD Model
LFECP6E-4TN144I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP | |
Package | Tray | |
Number of Logic Elements/Cells | 6100 | |
Total RAM Bits | 94208 | |
Number of I/O | 97 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 144-LQFP | |
Supplier Device Package | 144-TQFP (20x20) | |
Base Product Number | LFECP6 |
LFECP6E-4TN144I Datasheet Download
LFECP6E-4TN144I Overview
The LFECP6E-4TN144I is a Field Programmable Gate Array (FPGA) chip manufactured by Lattice Semiconductor Corporation. It is based on the LatticeECP6 family of FPGAs and is designed for high-performance applications. The chip has a total of 144 4K LUTs, 36 DSP blocks, 4,608 Kbits of RAM, and 72 I/O pins. It is capable of operating at speeds up to 200MHz and supports a wide variety of communication protocols, such as Ethernet, USB, and I2C.
The chip is designed for use in a variety of applications, including embedded systems, medical devices, consumer electronics, industrial automation, and aerospace. It offers a wide range of features, such as low power consumption, high-speed operation, and high-density logic. Additionally, the chip is designed to be used in a wide range of temperature ranges, from -40°C to 85°C.
The chip is designed for use in a variety of applications, including embedded systems, medical devices, consumer electronics, industrial automation, and aerospace. It offers a wide range of features, such as low power consumption, high-speed operation, and high-density logic. Additionally, the chip is designed to be used in a wide range of temperature ranges, from -40°C to 85°C.
The LFECP6E-4TN144I chip is designed to provide an efficient and cost-effective solution for applications requiring high performance, low power consumption, and high-density logic. It is suitable for a variety of applications, such as embedded systems, medical devices, consumer electronics, industrial automation, and aerospace. The chip is also designed to operate in a wide range of temperature ranges, making it suitable for a variety of environments.
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