LFECP6E-4TN144I
LFECP6E-4TN144I
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Lattice Semiconductor Corporation

LFECP6E-4TN144I


LFECP6E-4TN144I
ECP
F11-LFECP6E-4TN144I
Active
IC FPGA 97 I/O 144TQFP
144-TQFP (20x20)

LFECP6E-4TN144I ECAD Model


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LFECP6E-4TN144I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP
Package Tray
Number of Logic Elements/Cells 6100
Total RAM Bits 94208
Number of I/O 97
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Base Product Number LFECP6

LFECP6E-4TN144I Datasheet Download


LFECP6E-4TN144I Overview



The LFECP6E-4TN144I is a Field Programmable Gate Array (FPGA) chip manufactured by Lattice Semiconductor Corporation. It is based on the LatticeECP6 family of FPGAs and is designed for high-performance applications. The chip has a total of 144 4K LUTs, 36 DSP blocks, 4,608 Kbits of RAM, and 72 I/O pins. It is capable of operating at speeds up to 200MHz and supports a wide variety of communication protocols, such as Ethernet, USB, and I2C.


The chip is designed for use in a variety of applications, including embedded systems, medical devices, consumer electronics, industrial automation, and aerospace. It offers a wide range of features, such as low power consumption, high-speed operation, and high-density logic. Additionally, the chip is designed to be used in a wide range of temperature ranges, from -40°C to 85°C.


The chip is designed for use in a variety of applications, including embedded systems, medical devices, consumer electronics, industrial automation, and aerospace. It offers a wide range of features, such as low power consumption, high-speed operation, and high-density logic. Additionally, the chip is designed to be used in a wide range of temperature ranges, from -40°C to 85°C.


The LFECP6E-4TN144I chip is designed to provide an efficient and cost-effective solution for applications requiring high performance, low power consumption, and high-density logic. It is suitable for a variety of applications, such as embedded systems, medical devices, consumer electronics, industrial automation, and aerospace. The chip is also designed to operate in a wide range of temperature ranges, making it suitable for a variety of environments.



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