LFECP6E-3F256I
LFECP6E-3F256I
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Lattice Semiconductor Corporation

LFECP6E-3F256I


LFECP6E-3F256I
ECP
F11-LFECP6E-3F256I
Active
IC FPGA 195 I/O 256FBGA
256-FPBGA (17x17)

LFECP6E-3F256I ECAD Model


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LFECP6E-3F256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP
Package Tray
Number of Logic Elements/Cells 6100
Total RAM Bits 94208
Number of I/O 195
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFECP6

LFECP6E-3F256I Overview



The LFECP6E-3F256I is a high-performance, low-power FPGA chip designed by Lattice Semiconductor. It is based on the LatticeECP3 family of FPGAs and is ideal for a wide range of applications, from embedded designs to high-end communications systems.


The LFECP6E-3F256I chip features a low-power, low-cost design, with a maximum power consumption of only 0.7W. It is built using the LatticeECP3 architecture, which is optimized for low power and high performance. The chip also includes up to 256Kbits of embedded SRAM, making it suitable for a wide range of applications.


The LFECP6E-3F256I is a highly versatile FPGA chip, with a wide range of features and capabilities. It offers up to 8K logic elements, up to 256Kbits of embedded SRAM, up to 8Kbits of embedded Flash memory, up to 6 general-purpose I/O banks, up to 4 high-speed SERDES channels, and up to 6 PLLs. The chip also includes several advanced features, such as built-in clock management, low-skew clock distribution, and high-speed SERDES channels.


The LFECP6E-3F256I is ideal for a wide range of applications, such as embedded systems, industrial automation, medical imaging, communications, and consumer electronics. It is also suitable for a variety of other applications, such as automotive, aerospace, and defense.


Overall, the LFECP6E-3F256I is a powerful, low-power FPGA chip that offers a wide range of features and capabilities. It is suitable for a wide range of applications, from embedded designs to high-end communications systems.



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