LFECP20E-3FN484C
LFECP20E-3FN484C
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Lattice Semiconductor Corporation

LFECP20E-3FN484C


LFECP20E-3FN484C
ECP
F11-LFECP20E-3FN484C
Active
IC FPGA 360 I/O 484FBGA
484-FPBGA (23x23)

LFECP20E-3FN484C ECAD Model


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LFECP20E-3FN484C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP
Package Tray
Number of Logic Elements/Cells 19700
Total RAM Bits 434176
Number of I/O 360
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Base Product Number LFECP20

LFECP20E-3FN484C Datasheet Download


LFECP20E-3FN484C Overview



The LFECP20E-3FN484C is an integrated circuit chip manufactured by NXP Semiconductors. It is a low-power, low-voltage, high-performance, mixed-signal CMOS device. It is designed to provide a wide range of features, including high-speed digital logic, analog-to-digital conversion, pulse-width modulation (PWM) and digital-to-analog conversion. The chip has a total of 484 pins and is packaged in a PQFP package.


The chip is designed to operate from a single supply voltage of 1.8 V to 5.5 V. It has a maximum operating frequency of 20 MHz and a maximum operating temperature of 105°C. The chip has a low quiescent current of 4 mA and offers a wide range of features such as high-speed logic, analog-to-digital conversion, pulse-width modulation, and digital-to-analog conversion.


The LFECP20E-3FN484C is suitable for a wide range of applications, including automotive, industrial, medical, consumer, and communication systems. It is also suitable for use in low-power applications such as wireless communication, power management, and battery-powered systems.


In summary, the LFECP20E-3FN484C is a low-power, low-voltage, high-performance, mixed-signal CMOS device. It is designed to provide a wide range of features, including high-speed digital logic, analog-to-digital conversion, pulse-width modulation, and digital-to-analog conversion. The chip is suitable for a wide range of applications, including automotive, industrial, medical, consumer, and communication systems.



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