LFECP10E-4FN256I
LFECP10E-4FN256I
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Lattice Semiconductor Corporation

LFECP10E-4FN256I


LFECP10E-4FN256I
ECP
F11-LFECP10E-4FN256I
Active
IC FPGA 195 I/O 256FBGA
256-FPBGA (17x17)

LFECP10E-4FN256I ECAD Model


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LFECP10E-4FN256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP
Package Tray
Number of Logic Elements/Cells 10200
Total RAM Bits 282624
Number of I/O 195
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFECP10

LFECP10E-4FN256I Datasheet Download


LFECP10E-4FN256I Overview



The LFECP10E-4FN256I is a low-power, low-cost, highly integrated, field programmable gate array (FPGA) chip. It is manufactured by Lattice Semiconductor Corporation and is based on their LatticeECP2M architecture.


The chip has a 4 million system gate equivalent capacity, and is capable of providing up to 256 I/O pins. It is available in a range of packages, including a 256-pin, 0.5mm pitch, BGA package. The chip also features a wide range of configurable I/O functions, such as LVDS, LVCMOS, and differential I/O.


The LFECP10E-4FN256I is designed for low power applications, with a maximum power consumption of only 1.5W. It is also designed to be highly reliable, with an extended temperature range of -40 to +85°C.


The chip is suitable for a wide range of applications, including embedded systems, medical and industrial automation, communications, and networking. It can be used for various tasks such as video processing, data acquisition, signal processing, and control systems.


The LFECP10E-4FN256I is an ideal choice for designers looking for a low-cost, low-power FPGA solution for their application. It provides a high level of integration, reliability, and flexibility, making it suitable for a wide range of applications.



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