
Lattice Semiconductor Corporation
LFECP10E-4FN256I
LFECP10E-4FN256I ECAD Model
LFECP10E-4FN256I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP | |
Package | Tray | |
Number of Logic Elements/Cells | 10200 | |
Total RAM Bits | 282624 | |
Number of I/O | 195 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Base Product Number | LFECP10 |
LFECP10E-4FN256I Datasheet Download
LFECP10E-4FN256I Overview
The LFECP10E-4FN256I is a low-power, low-cost, highly integrated, field programmable gate array (FPGA) chip. It is manufactured by Lattice Semiconductor Corporation and is based on their LatticeECP2M architecture.
The chip has a 4 million system gate equivalent capacity, and is capable of providing up to 256 I/O pins. It is available in a range of packages, including a 256-pin, 0.5mm pitch, BGA package. The chip also features a wide range of configurable I/O functions, such as LVDS, LVCMOS, and differential I/O.
The LFECP10E-4FN256I is designed for low power applications, with a maximum power consumption of only 1.5W. It is also designed to be highly reliable, with an extended temperature range of -40 to +85°C.
The chip is suitable for a wide range of applications, including embedded systems, medical and industrial automation, communications, and networking. It can be used for various tasks such as video processing, data acquisition, signal processing, and control systems.
The LFECP10E-4FN256I is an ideal choice for designers looking for a low-cost, low-power FPGA solution for their application. It provides a high level of integration, reliability, and flexibility, making it suitable for a wide range of applications.
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