LFEC6E-3FN484C
LFEC6E-3FN484C
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Lattice Semiconductor Corporation

LFEC6E-3FN484C


LFEC6E-3FN484C
EC
F11-LFEC6E-3FN484C
Active
IC FPGA 224 I/O 484FBGA
484-FPBGA (23x23)

LFEC6E-3FN484C ECAD Model


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LFEC6E-3FN484C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series EC
Package Tray
Number of Logic Elements/Cells 6100
Total RAM Bits 94208
Number of I/O 224
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Base Product Number LFEC6

LFEC6E-3FN484C Datasheet Download


LFEC6E-3FN484C Overview



The LFEC6E-3FN484C is an integrated circuit chip manufactured by Texas Instruments. It is a low-power field-programmable gate array (FPGA) with a logic capacity of 6,000 logic cells and a total of 4,800 usable logic gates. It is designed to be used in applications requiring low power consumption and high speed.


The LFEC6E-3FN484C has an operating voltage range of 1.14V to 3.3V and a maximum operating temperature of 85°C. It has a maximum power dissipation of 1.2W and can run at clock frequencies of up to 350MHz. Its package size is 6x6mm and it has a total of 484 I/O pins. It is designed to be used in a variety of applications, such as automotive, industrial, medical, and communications.


The LFEC6E-3FN484C has a variety of features which make it suitable for use in a wide range of applications. Its low power consumption and high speed make it ideal for use in applications which require high performance and low power consumption. Its package size makes it suitable for use in space-constrained applications, such as mobile devices. Its I/O pins make it suitable for use in applications which require high connectivity.


Overall, the LFEC6E-3FN484C is an ideal choice for applications which require low power consumption, high speed, and high connectivity. Its low power consumption and high speed make it suitable for use in a variety of applications, including automotive, industrial, medical, and communications. Its package size and I/O pins make it suitable for use in space-constrained and highly connected applications.



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