
Lattice Semiconductor Corporation
LFEC20E-4FN484I
LFEC20E-4FN484I ECAD Model
LFEC20E-4FN484I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | EC | |
Package | Tray | |
Number of Logic Elements/Cells | 19700 | |
Total RAM Bits | 434176 | |
Number of I/O | 360 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 484-BBGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Base Product Number | LFEC20 |
LFEC20E-4FN484I Datasheet Download
LFEC20E-4FN484I Overview
The LFEC20E-4FN484I is a high-performance, low-power, 28-nanometer (nm) field-programmable gate array (FPGA) chip from Intel. It is designed for use in high-speed networking, data center, and communication applications. It offers up to 4.8 million logic elements, and up to 1.3 terabits per second (Tbps) of interconnect bandwidth. The chip also features a wide range of I/O options, including high-speed serial transceivers, DDR3/DDR4 memory controllers, and PCI Express Gen 3.0.
The LFEC20E-4FN484I is designed to provide high performance, low power consumption, and scalability. It uses Intel's advanced 28nm process technology, which provides faster performance and lower power consumption than other FPGA chips. It also features a low-power, low-voltage design, which allows for improved power efficiency and thermal management.
The chip features a range of features designed to improve overall performance. It includes a high-performance, low-latency, low-power, and low-cost architecture. It also features a range of configurable logic blocks, including look-up tables, multiplexers, and arithmetic logic units. Additionally, the chip supports a range of high-speed serial transceivers, including PCIe, USB 3.0, and SATA.
The LFEC20E-4FN484I is suitable for a wide range of applications, including high-speed networking, data center, and communication applications. It is also suitable for embedded applications, such as industrial automation, automotive, and medical devices. The chip is available in a range of package options, including BGA, VFBGA, and QFN.
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