LFEC20E-4FN484I
LFEC20E-4FN484I
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Lattice Semiconductor Corporation

LFEC20E-4FN484I


LFEC20E-4FN484I
EC
F11-LFEC20E-4FN484I
Active
IC FPGA 360 I/O 484FBGA
484-FPBGA (23x23)

LFEC20E-4FN484I ECAD Model


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LFEC20E-4FN484I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series EC
Package Tray
Number of Logic Elements/Cells 19700
Total RAM Bits 434176
Number of I/O 360
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Base Product Number LFEC20

LFEC20E-4FN484I Datasheet Download


LFEC20E-4FN484I Overview



The LFEC20E-4FN484I is a high-performance, low-power, 28-nanometer (nm) field-programmable gate array (FPGA) chip from Intel. It is designed for use in high-speed networking, data center, and communication applications. It offers up to 4.8 million logic elements, and up to 1.3 terabits per second (Tbps) of interconnect bandwidth. The chip also features a wide range of I/O options, including high-speed serial transceivers, DDR3/DDR4 memory controllers, and PCI Express Gen 3.0.


The LFEC20E-4FN484I is designed to provide high performance, low power consumption, and scalability. It uses Intel's advanced 28nm process technology, which provides faster performance and lower power consumption than other FPGA chips. It also features a low-power, low-voltage design, which allows for improved power efficiency and thermal management.


The chip features a range of features designed to improve overall performance. It includes a high-performance, low-latency, low-power, and low-cost architecture. It also features a range of configurable logic blocks, including look-up tables, multiplexers, and arithmetic logic units. Additionally, the chip supports a range of high-speed serial transceivers, including PCIe, USB 3.0, and SATA.


The LFEC20E-4FN484I is suitable for a wide range of applications, including high-speed networking, data center, and communication applications. It is also suitable for embedded applications, such as industrial automation, automotive, and medical devices. The chip is available in a range of package options, including BGA, VFBGA, and QFN.



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