LFEC1E-3T100I
LFEC1E-3T100I
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Lattice Semiconductor Corporation

LFEC1E-3T100I


LFEC1E-3T100I
EC
F11-LFEC1E-3T100I
Active
IC FPGA 67 I/O 100TQFP
100-TQFP (14x14)

LFEC1E-3T100I ECAD Model


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LFEC1E-3T100I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series EC
Package Tray
Number of Logic Elements/Cells 1500
Total RAM Bits 18432
Number of I/O 67
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 100-LQFP
Supplier Device Package 100-TQFP (14x14)
Base Product Number LFEC1

LFEC1E-3T100I Overview



The LFEC1E-3T100I is a low-power, high-performance chip model manufactured by Texas Instruments. It is designed to provide a wide range of features and capabilities in a single package. This chip features a three-phase brushless motor controller, a 12-bit analog-to-digital converter (ADC), a pulse-width modulation (PWM) generator, and a three-phase current sensor. The chip also includes a low-voltage differential signaling (LVDS) serial interface and a programmable logic controller (PLC).


The LFEC1E-3T100I is designed to provide a low-power, high-performance solution for a variety of applications. It is suitable for use in motor control, robotics, and automotive applications. The chip features a wide operating range of 0.9V to 3.6V and can operate at temperatures ranging from -40°C to +85°C. The chip also has a low quiescent current of only 6.5mA.


The chip has a high-speed PWM generator that can generate up to 3MHz frequency, and a 12-bit ADC with a resolution of up to 0.5%. The chip also has an integrated three-phase current sensor that can detect up to 1A of current. The integrated LVDS serial interface can be used to communicate with external devices, such as a microcontroller or a PC.


The LFEC1E-3T100I is a highly integrated and cost-effective solution for a variety of motor control and robotics applications. It is suitable for use in a variety of applications, including motor control, robotics, and automotive applications. The chip provides a low-power, high-performance solution for a variety of applications.



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