LFEC10E-3Q208I
LFEC10E-3Q208I
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Lattice Semiconductor Corporation

LFEC10E-3Q208I


LFEC10E-3Q208I
EC
F11-LFEC10E-3Q208I
Active
IC FPGA 147 I/O 208QFP
208-PQFP (28x28)

LFEC10E-3Q208I ECAD Model


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LFEC10E-3Q208I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series EC
Package Tray
Number of Logic Elements/Cells 10200
Total RAM Bits 282624
Number of I/O 147
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28x28)
Base Product Number LFEC10

LFEC10E-3Q208I Overview



The LFEC10E-3Q208I is a low-power, low-cost, high-performance Field Programmable Gate Array (FPGA) chip from Lattice Semiconductor. It is based on the LatticeECP2M architecture and provides up to 10 million system gates and up to 576 Kbits of embedded memory. It offers a wide range of features, including low power consumption, high performance, low cost, and high I/O density.


The LFEC10E-3Q208I chip has a total of 208 I/O pins, which can be used for various purposes, such as configuring, programming, and controlling the device. It has a maximum clock speed of up to 400 MHz and can support up to 3.3V and 1.8V I/O standards. It also features a single-ended and differential I/O support, and a wide range of user-programmable features.


The LFEC10E-3Q208I chip is designed for a variety of applications, including embedded systems, industrial automation, automotive, communications, and consumer electronics. It is suitable for high-speed data processing, image processing, data acquisition, and real-time control applications. It also supports a wide range of development tools, such as the Lattice Diamond, Lattice Studio, and Lattice iCEcube2.


In summary, the LFEC10E-3Q208I is a low-power, low-cost, high-performance FPGA chip from Lattice Semiconductor. It offers a wide range of features, such as low power consumption, high performance, low cost, and high I/O density. It is suitable for a variety of applications, including embedded systems, industrial automation, automotive, communications, and consumer electronics.



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