LFEC10E-3F484I
LFEC10E-3F484I
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Lattice Semiconductor Corporation

LFEC10E-3F484I


LFEC10E-3F484I
EC
F11-LFEC10E-3F484I
Active
IC FPGA 288 I/O 484FBGA
484-FPBGA (23x23)

LFEC10E-3F484I ECAD Model


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LFEC10E-3F484I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series EC
Package Tray
Number of Logic Elements/Cells 10200
Total RAM Bits 282624
Number of I/O 288
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Base Product Number LFEC10

LFEC10E-3F484I Datasheet Download


LFEC10E-3F484I Overview



The LFEC10E-3F484I is a low-power, high-performance, field-programmable gate array (FPGA) chip. It is designed to provide users with an efficient and cost-effective solution for embedded applications. It is manufactured using a 0.13 micron CMOS process and is capable of providing up to 8 million system gates.


The chip has an array of 16,384 logic cells, each containing four programmable logic blocks, two dedicated input/output blocks, and two dedicated multiplexers. Each logic block is capable of implementing up to four logic functions, providing users with a high degree of flexibility. The input/output blocks are capable of providing up to 484 user-defined I/O pins. The chip also includes four dedicated clock management blocks, providing a total of 8 clock inputs.


The chip features a wide range of features, including low power consumption, high performance, low cost, and a wide range of I/O options. It is suitable for a variety of applications, such as automotive, industrial, consumer, and communications. It can be used for a wide range of embedded applications, such as image processing, signal processing, control systems, and communications.


In summary, the LFEC10E-3F484I is a low-power, high-performance, field-programmable gate array chip that provides users with an efficient and cost-effective solution for embedded applications. It features a wide range of features, including low power consumption, high performance, low cost, and a wide range of I/O options. It is suitable for a variety of applications, such as automotive, industrial, consumer, and communications.



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