
Lattice Semiconductor Corporation
LFE3-70E-6FN484I
LFE3-70E-6FN484I ECAD Model
LFE3-70E-6FN484I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP3 | |
Package | Tray | |
Number of LABs/CLBs | 8375 | |
Number of Logic Elements/Cells | 67000 | |
Total RAM Bits | 4526080 | |
Number of I/O | 295 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 484-BBGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Base Product Number | LFE3-70 |
LFE3-70E-6FN484I Datasheet Download
LFE3-70E-6FN484I Overview
The LFE3-70E-6FN484I is a low-power, high-performance, field-programmable gate array (FPGA) chip from Xilinx. It is the latest in the LFE3 family of devices and offers a wide range of features and capabilities. The device is built on the 28nm UltraScale architecture and has 6.5 million logic cells, 1.2 million flip-flops, and 4.8 million memory bits. It also includes up to 456 18x18 multipliers, eight integrated DSP slices, and up to 3600 I/Os.
The chip is designed for a wide range of applications, including high-speed networking, high-bandwidth video processing, and high-performance computing. It has a wide range of features that make it suitable for these applications, such as low power consumption, high performance, and a wide range of I/O options. The device also has a variety of built-in features, such as a high-speed transceiver, DDR3/4 interface, and multiple clock sources.
The LFE3-70E-6FN484I is available in a range of package options, including a 6x6mm BGA and a 5x5mm BGA. It is also available in a range of temperature grades, from commercial to industrial. The device is also RoHS compliant and can operate at temperatures from -40°C to +85°C.
Overall, the LFE3-70E-6FN484I is a high-performance, low-power FPGA chip that is suitable for a wide range of applications. It offers a wide range of features and capabilities, making it an ideal choice for high-speed networking, high-bandwidth video processing, and high-performance computing applications.
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