LFE3-70E-6FN484I
LFE3-70E-6FN484I
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rohs

Lattice Semiconductor Corporation

LFE3-70E-6FN484I


LFE3-70E-6FN484I
F11-LFE3-70E-6FN484I
Active
IC FPGA 295 I/O 484FBGA
484-FPBGA (23x23)

LFE3-70E-6FN484I ECAD Model


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LFE3-70E-6FN484I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP3
Package Tray
Number of LABs/CLBs 8375
Number of Logic Elements/Cells 67000
Total RAM Bits 4526080
Number of I/O 295
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Base Product Number LFE3-70

LFE3-70E-6FN484I Datasheet Download


LFE3-70E-6FN484I Overview



The LFE3-70E-6FN484I is a low-power, high-performance, field-programmable gate array (FPGA) chip from Xilinx. It is the latest in the LFE3 family of devices and offers a wide range of features and capabilities. The device is built on the 28nm UltraScale architecture and has 6.5 million logic cells, 1.2 million flip-flops, and 4.8 million memory bits. It also includes up to 456 18x18 multipliers, eight integrated DSP slices, and up to 3600 I/Os.


The chip is designed for a wide range of applications, including high-speed networking, high-bandwidth video processing, and high-performance computing. It has a wide range of features that make it suitable for these applications, such as low power consumption, high performance, and a wide range of I/O options. The device also has a variety of built-in features, such as a high-speed transceiver, DDR3/4 interface, and multiple clock sources.


The LFE3-70E-6FN484I is available in a range of package options, including a 6x6mm BGA and a 5x5mm BGA. It is also available in a range of temperature grades, from commercial to industrial. The device is also RoHS compliant and can operate at temperatures from -40°C to +85°C.


Overall, the LFE3-70E-6FN484I is a high-performance, low-power FPGA chip that is suitable for a wide range of applications. It offers a wide range of features and capabilities, making it an ideal choice for high-speed networking, high-bandwidth video processing, and high-performance computing applications.



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