LFE2-12SE-5F256C
LFE2-12SE-5F256C
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Lattice Semiconductor Corporation

LFE2-12SE-5F256C


LFE2-12SE-5F256C
F11-LFE2-12SE-5F256C
Active
IC FPGA 193 I/O 256FBGA
256-FPBGA (17x17)

LFE2-12SE-5F256C ECAD Model


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LFE2-12SE-5F256C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP2
Package Tray
Number of LABs/CLBs 1500
Number of Logic Elements/Cells 12000
Total RAM Bits 226304
Number of I/O 193
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFE2-12

LFE2-12SE-5F256C Datasheet Download


LFE2-12SE-5F256C Overview



The LFE2-12SE-5F256C is an FPGA chip model from Lattice Semiconductor. It is a low-cost, low-power, and low-density device that is ideal for a variety of applications. It is a single-chip solution that combines a Field Programmable Gate Array (FPGA) and a Power Management Unit (PMU).


The FPGA core of the LFE2-12SE-5F256C features 12K logic elements and 256Kbits of RAM. It is designed to provide high performance and low power consumption. It also has a wide range of I/O capabilities, including LVDS, LVCMOS, and SPI. The PMU provides power management, clock management, and system monitoring functions.


The LFE2-12SE-5F256C is suitable for a wide range of applications, including industrial automation, automotive, consumer electronics, medical, and aerospace. It is ideal for applications that require a cost-effective solution with low power consumption and high performance. It can also be used for applications that require a wide range of I/O capabilities.


In summary, the LFE2-12SE-5F256C is a low-cost, low-power, and low-density FPGA chip model from Lattice Semiconductor. It features 12K logic elements and 256Kbits of RAM and has a wide range of I/O capabilities. It is ideal for applications that require a cost-effective solution with low power consumption and high performance. It is suitable for a wide range of applications, including industrial automation, automotive, consumer electronics, medical, and aerospace.



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