
Lattice Semiconductor Corporation
LFE2-12SE-5F256C
LFE2-12SE-5F256C ECAD Model
LFE2-12SE-5F256C Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ECP2 | |
Package | Tray | |
Number of LABs/CLBs | 1500 | |
Number of Logic Elements/Cells | 12000 | |
Total RAM Bits | 226304 | |
Number of I/O | 193 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Base Product Number | LFE2-12 |
LFE2-12SE-5F256C Datasheet Download
LFE2-12SE-5F256C Overview
The LFE2-12SE-5F256C is an FPGA chip model from Lattice Semiconductor. It is a low-cost, low-power, and low-density device that is ideal for a variety of applications. It is a single-chip solution that combines a Field Programmable Gate Array (FPGA) and a Power Management Unit (PMU).
The FPGA core of the LFE2-12SE-5F256C features 12K logic elements and 256Kbits of RAM. It is designed to provide high performance and low power consumption. It also has a wide range of I/O capabilities, including LVDS, LVCMOS, and SPI. The PMU provides power management, clock management, and system monitoring functions.
The LFE2-12SE-5F256C is suitable for a wide range of applications, including industrial automation, automotive, consumer electronics, medical, and aerospace. It is ideal for applications that require a cost-effective solution with low power consumption and high performance. It can also be used for applications that require a wide range of I/O capabilities.
In summary, the LFE2-12SE-5F256C is a low-cost, low-power, and low-density FPGA chip model from Lattice Semiconductor. It features 12K logic elements and 256Kbits of RAM and has a wide range of I/O capabilities. It is ideal for applications that require a cost-effective solution with low power consumption and high performance. It is suitable for a wide range of applications, including industrial automation, automotive, consumer electronics, medical, and aerospace.
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