LFE2-12E-6FN256I

The LFE2-12E-6FN256I chip is a low-power, low-cost, field-programmable gate array (FPGA) device manufactured by Lattice Semiconductor. It is based on the LatticeECP2M architecture and is suitable for a wide range of applications, including embedded systems, communication systems, industrial automation, automotive, and medical applications.

The LFE2-12E-6FN256I chip has 256 logic cells, each of which contains four 6-input look-up tables (LUTs), two flip-flops, and dedicated DSP blocks. It also has 12 dedicated DSP blocks, which can be used for digital signal processing (DSP) operations. It has a total of 6,144 logic elements, which can be used to implement complex logic functions. The chip also features two independent power domains, which can be used to reduce power consumption.

The LFE2-12E-6FN256I chip has a maximum operating frequency of up to 250 MHz. It has an I/O count of 191 and supports up to 32 user-defined I/O banks. It also supports multiple I/O standards, including LVDS, LVCMOS, and SSTL. The chip has a maximum operating temperature of up to 105°C and is available in a range of package options, including BGA, VFBGA, and VQFN.

The LFE2-12E-6FN256I chip is designed for a wide range of applications, including embedded systems, communication systems, industrial automation, automotive, and medical applications. It has a low power consumption and is suitable for low-cost applications. It is also suitable for use in high-density designs, as it has a high logic element count and I/O count.