LCMXO2-1200ZE-3TG100IR1
LCMXO2-1200ZE-3TG100IR1
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Lattice Semiconductor Corporation

LCMXO2-1200ZE-3TG100IR1


LCMXO2-1200ZE-3TG100IR1
F11-LCMXO2-1200ZE-3TG100IR1
Active
IC FPGA 79 I/O 100TQFP
100-TQFP (14x14)

LCMXO2-1200ZE-3TG100IR1 ECAD Model


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LCMXO2-1200ZE-3TG100IR1 Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series MachXO2
Package Tray
Number of LABs/CLBs 160
Number of Logic Elements/Cells 1280
Total RAM Bits 65536
Number of I/O 79
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 100-LQFP
Supplier Device Package 100-TQFP (14x14)
Base Product Number LCMXO2-1200

LCMXO2-1200ZE-3TG100IR1 Datasheet Download


LCMXO2-1200ZE-3TG100IR1 Overview



The LCMXO2-1200ZE-3TG100IR1 is a FPGA (Field Programmable Gate Array) chip from Lattice Semiconductor. It is a low-cost, low-power, high-performance device that is suitable for a wide range of applications.


The LCMXO2-1200ZE-3TG100IR1 has a total of 1,200 Look-Up Tables (LUTs) and 100Kbits of embedded memory. It features a maximum operating frequency of up to 300MHz, and a maximum input/output (I/O) voltage of 3.3V. The device also has a total of 8Kbits of user-configurable SRAM and supports up to 1,024 I/O pins.


The LCMXO2-1200ZE-3TG100IR1 is ideal for applications such as industrial automation, medical imaging, communications, consumer electronics, and automotive. It is also suitable for applications that require a low-power solution and high performance.


The LCMXO2-1200ZE-3TG100IR1 is available in a variety of packages, including BGA, VFBGA, and TQFP. The device is RoHS compliant and is lead-free and halogen-free. It also supports a variety of design tools and development tools, including Lattice Diamond, Lattice iCEcube2, and Lattice Radiant.


In conclusion, the LCMXO2-1200ZE-3TG100IR1 is a low-cost, low-power, and high-performance FPGA chip from Lattice Semiconductor. It is suitable for a wide range of applications, including industrial automation, medical imaging, communications, consumer electronics, and automotive. It is available in a variety of packages and supports a variety of design and development tools.



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