
Lattice Semiconductor Corporation
LCMXO2-1200HC-6TG144CR1
LCMXO2-1200HC-6TG144CR1 ECAD Model
LCMXO2-1200HC-6TG144CR1 Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | MachXO2 | |
Package | Tray | |
Number of LABs/CLBs | 160 | |
Number of Logic Elements/Cells | 1280 | |
Total RAM Bits | 65536 | |
Number of I/O | 107 | |
Voltage - Supply | 2.375V ~ 3.465V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 144-LQFP | |
Supplier Device Package | 144-TQFP (20x20) | |
Base Product Number | LCMXO2-1200 |
LCMXO2-1200HC-6TG144CR1 Datasheet Download
LCMXO2-1200HC-6TG144CR1 Overview
The LCMXO2-1200HC-6TG144CR1 is a high-performance, low-power FPGA (Field Programmable Gate Array) chip from Lattice Semiconductor. It is based on the Lattice MACHXO2 family of FPGAs and features a 6-input look-up table (LUT) with up to 144Kbits of embedded memory. The chip is housed in a small 6x6mm package, making it suitable for applications where space is at a premium.
The LCMXO2-1200HC-6TG144CR1 offers a range of features and can be used for a variety of applications. It has a maximum operating frequency of up to 120MHz, and it is capable of up to 8.5Mbits/s of data throughput. It also has a wide range of I/O options, with support for LVDS, LVCMOS and differential I/O. The chip also features advanced power management features, including dynamic power scaling and power-down modes.
The LCMXO2-1200HC-6TG144CR1 is suitable for a wide range of applications, including industrial, automotive, consumer, and medical. It can be used for data acquisition, control systems, embedded systems, and communication systems. It is also suitable for applications that require low power consumption and high performance.
In short, the LCMXO2-1200HC-6TG144CR1 is a high-performance, low-power FPGA chip from Lattice Semiconductor that is suitable for a wide range of applications. It has a maximum operating frequency of up to 120MHz, and it is capable of up to 8.5Mbits/s of data throughput. The chip also features advanced power management features, and it is housed in a small 6x6mm package.
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