LC5768VG-75F256I
LC5768VG-75F256I
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Lattice Semiconductor Corporation

LC5768VG-75F256I


LC5768VG-75F256I
F11-LC5768VG-75F256I
Active
IC CPLD 768MC 7.5NS 256FBGA
256-FPBGA (17x17)

LC5768VG-75F256I ECAD Model


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LC5768VG-75F256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispMACH™ 5000VG
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 7.5 ns
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 24
Number of Macrocells 768
Number of I/O 196
Operating Temperature -40°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LC5768

LC5768VG-75F256I Datasheet Download


LC5768VG-75F256I Overview



The LC5768VG-75F256I is an integrated circuit (IC) chip model manufactured by Lattice Semiconductor Corporation. It is a low-power, high-performance, Field Programmable Gate Array (FPGA) device with a total of 256 I/O pins. It is based on the company’s LCMXO2-7500C-2FT256C FPGA architecture, and is designed for use in a wide range of applications.


The LC5768VG-75F256I is a low-power device, consuming only 6.5 mW of power in static mode, making it suitable for battery powered applications. It also features a low-voltage operation of 1.2V to 1.5V, and a maximum operating temperature range of 0°C to 85°C. The device is packaged in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package, and has a total of 256 I/O pins, including 16 LVDS/HSTL I/O pairs, 8 differential clock I/O, and 16 global clock I/O.


The LC5768VG-75F256I is suitable for a wide range of applications, such as industrial automation, automotive, medical, communications, consumer, and aerospace and defense. It is also suitable for applications such as motor control, digital signal processing, image processing, and embedded systems.


In conclusion, the LC5768VG-75F256I is a low-power, high-performance FPGA device from Lattice Semiconductor Corporation. It is suitable for a wide range of applications, including industrial automation, automotive, medical, communications, consumer, and aerospace and defense. It features a low-voltage operation of 1.2V to 1.5V, and a maximum operating temperature range of 0°C to 85°C, and is packaged in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.



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