
Lattice Semiconductor Corporation
LC4384B-75FN256I
LC4384B-75FN256I ECAD Model
LC4384B-75FN256I Attributes
Type | Description | Select |
---|---|---|
Mfr | Lattice Semiconductor Corporation | |
Series | ispMACH® 4000B | |
Package | Tray | |
Programmable Type | In System Programmable | |
Delay Time tpd(1) Max | 7.5 ns | |
Voltage Supply - Internal | 2.3V ~ 2.7V | |
Number of Logic Elements/Blocks | 24 | |
Number of Macrocells | 384 | |
Number of I/O | 192 | |
Operating Temperature | -40°C ~ 105°C (TJ) | |
Mounting Type | Surface Mount | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Base Product Number | LC4384 |
LC4384B-75FN256I Datasheet Download
LC4384B-75FN256I Overview
The LC4384B-75FN256I is a high-performance, low-power, low-voltage, 256-bit CMOS static RAM chip. It is designed for use in a wide range of applications, including industrial control, automotive, telecommunications, networking and consumer electronics. The chip features an advanced CMOS design with an operating voltage range of 2.7 to 3.6V and a maximum operating frequency of 75MHz. It has a data bus width of 256 bits, allowing for high-speed data transfer and storage.
The LC4384B-75FN256I is designed to provide high-speed access to data stored in its memory, with a maximum access time of 75ns. It has an asynchronous read/write capability and supports both single-cycle and burst read/write operations. The chip also features an auto-precharge mode, which allows for automatic precharge of the memory before a read or write operation is performed.
The LC4384B-75FN256I is designed for use in applications that require low power consumption and high performance. The chip offers a low standby current of 0.3μA and a maximum active current of 7mA. It also features a low power-down current of 0.1μA.
The LC4384B-75FN256I is suitable for a wide range of applications, including industrial control, automotive, telecommunications, networking and consumer electronics. It is also suitable for use in systems that require high-speed data transfer and storage. The chip is available in a variety of package types, including PQFP, TQFP and BGA, making it suitable for a wide range of applications.
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