LC4256C-75FTN256BI
LC4256C-75FTN256BI
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Lattice Semiconductor Corporation

LC4256C-75FTN256BI


LC4256C-75FTN256BI
F11-LC4256C-75FTN256BI
Active
IC CPLD 256MC 7.5NS 256FTBGA
256-FTBGA (17x17)

LC4256C-75FTN256BI ECAD Model


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LC4256C-75FTN256BI Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispMACH® 4000C
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 7.5 ns
Voltage Supply - Internal 1.65V ~ 1.95V
Number of Logic Elements/Blocks 16
Number of Macrocells 256
Number of I/O 160
Operating Temperature -40°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number LC4256

LC4256C-75FTN256BI Datasheet Download


LC4256C-75FTN256BI Overview



LC4256C-75FTN256BI is a high-performance, low-power SRAM chip from Lattice Semiconductor. It is a non-volatile memory device with a capacity of 256Kb. The chip has a single-supply voltage of 3.3V, and a maximum operating frequency of 75MHz. It also has a standby current of 0.5mA and an operating current of 2mA.


The chip supports a number of features such as auto-refresh, burst read/write, and a write-protect feature. It also has a built-in error correction circuit (ECC) that can detect and correct single-bit errors. The chip has a wide operating temperature range of -40°C to +85°C.


The LC4256C-75FTN256BI is suitable for a variety of applications including embedded systems, industrial automation, automotive systems, medical devices, and consumer electronics. It can be used for data storage and retrieval, data logging, and other memory-intensive applications.


The chip is also available in a variety of packages including TQFP, LFBGA, and BGA. It is also RoHS compliant and meets the requirements of the JEDEC standards.


Overall, the LC4256C-75FTN256BI is a reliable and efficient memory chip with a wide range of features. It is suitable for a variety of applications and can be used in a variety of packages.



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