LC4256C-75FTN256BC
LC4256C-75FTN256BC
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Lattice Semiconductor Corporation

LC4256C-75FTN256BC


LC4256C-75FTN256BC
F11-LC4256C-75FTN256BC
Active
IC CPLD 256MC 7.5NS 256FTBGA
256-FTBGA (17x17)

LC4256C-75FTN256BC ECAD Model


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LC4256C-75FTN256BC Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispMACH® 4000C
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 7.5 ns
Voltage Supply - Internal 1.65V ~ 1.95V
Number of Logic Elements/Blocks 16
Number of Macrocells 256
Number of I/O 160
Operating Temperature 0°C ~ 90°C (TJ)
Mounting Type Surface Mount
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number LC4256

LC4256C-75FTN256BC Datasheet Download


LC4256C-75FTN256BC Overview



The LC4256C-75FTN256BC is a high-performance, low-power, single-chip model designed for a variety of applications. It is a 256-bit FPGA with a wide range of features, including 16K logic elements, 32K RAM, and two high-speed transceivers. It also features a wide variety of I/O options, including LVDS, LVCMOS, and SSTL.


The LC4256C-75FTN256BC is a low-power device that consumes only 6.5W at full operation. It is also designed to operate in a wide temperature range, from -40°C to +85°C. It is also highly reliable, with a mean time between failure (MTBF) of greater than 1 million hours.


The LC4256C-75FTN256BC is suitable for a variety of applications, including industrial automation, medical imaging, and communications. Its high-speed transceivers enable it to be used for high-speed communication protocols such as Ethernet, USB, and HDMI. Its low-power consumption and wide temperature range also make it suitable for use in embedded systems and automotive applications.


In summary, the LC4256C-75FTN256BC is a high-performance, low-power, single-chip model designed for a variety of applications. It features 16K logic elements, 32K RAM, and two high-speed transceivers, as well as a wide range of I/O options. It is suitable for use in industrial automation, medical imaging, communications, embedded systems, and automotive applications.



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