LC4256C-3FTN256AC
LC4256C-3FTN256AC
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Lattice Semiconductor Corporation

LC4256C-3FTN256AC


LC4256C-3FTN256AC
F11-LC4256C-3FTN256AC
Active
IC CPLD 256MC 3NS 256FTBGA
256-FTBGA (17x17)

LC4256C-3FTN256AC ECAD Model


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LC4256C-3FTN256AC Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispMACH® 4000C
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 3 ns
Voltage Supply - Internal 1.65V ~ 1.95V
Number of Logic Elements/Blocks 16
Number of Macrocells 256
Number of I/O 128
Operating Temperature 0°C ~ 90°C (TJ)
Mounting Type Surface Mount
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number LC4256

LC4256C-3FTN256AC Datasheet Download


LC4256C-3FTN256AC Overview



The LC4256C-3FTN256AC is a low power, high performance Field Programmable Gate Array (FPGA) chip manufactured by Lattice Semiconductor Corporation. It is a member of the LatticeECP2/M family of FPGAs and is designed for use in a wide variety of applications.


The LC4256C-3FTN256AC features a 256-bit wide data path, a total of 4,096 logic cells and up to 64Kbits of embedded memory. It also has a total of 256 I/O pins, with up to 16 dedicated differential pairs for high speed I/O applications. The device is also equipped with an array of logic blocks, including Look-Up Tables (LUTs), Multipliers, and Memory Blocks, allowing for a variety of complex functions to be implemented.


The LC4256C-3FTN256AC is designed to operate at a maximum frequency of 200 MHz and consumes up to 1.5 W of power. It is also equipped with advanced power management features, such as power-down modes and dynamic power management, which helps reduce power consumption.


The LC4256C-3FTN256AC is suitable for a wide range of applications, including industrial control, medical imaging, video and audio processing, networking, and automotive systems. It is also suitable for use in high-speed data acquisition and signal processing applications. It is available in a variety of packages, including a small form factor BGA package, making it suitable for use in space-constrained applications.



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